Industry Directory | Manufacturer
Pioneers in the area of solderless assembly technology and originators of the OCCAM process. Developing IP for next and future generations of high reliability and better performing electronic products.
Datum Alloys is an international supplier of speciality metals and special purpose alloys,
Inline x-ray inspection system for combined 3D and transmission x-ray analysis of double-sided boards with high package density. Universal standard system based on the MatriX X2.5 AXI system motion concept with 360º angle shot coverage. A new 3D reco
Used SMT Equipment | Soldering - Wave
Vitronics Soltec Delta Wave Solder The Delta Wave Soldering System is designed for three-shift, high volume production with maximum uptime. Precise and repeatable soldering results are provided by digital motor controls which maintain variation to
The X3 is an automatic X-Ray inspection system featuring combined Transmission and 3D Technology for sophisticated high-speed inspection in electronic production. The system is based on the motion concept of the MatriX X2.5 AXI system. A newly develo
The need for automatic optical inspection (AOI) in the SMT assembly industry is clear. Increasing miniaturisation and placement densities mean that only an AOI system can reliably detect all types of solder defects at line speeds and at a reasonable
Wide variety of styles including Peel-A-Way� low profile removable carrier, high density molded connectors, and more. Patented features such as solder preforms and screw-machined terminals offer high reliability.
New Equipment | Solder Materials
High Reliability Lead-Free Solder Spheres SN100C. eBall Selection: Impact Strength SN100C (Sn-Cu-Ni+Ge) Solder spheres with excellent impact strength, suitable for BGA, CSP, MCM and high density fine pitch
Used SMT Equipment | AOI / Automated Optical Inspection
SAKY BF-PLANET-X With a superior resolution of 10μm and scanning line color CCD camera, both AOI system provide accurate and stable inspection results. Solder fillets on components as small as the high density mounted 01005(0402) chip, as well a
SOLDERITE ULF-210RN, ULF-210RNI, ULF-250, ULF-300VZ-3, and ULF-500VS are ultra low residue type flux and these are developed for soldering printed circuit board mounted chip componenets and flat ICs which are for miniaturize and high density purpose.
