Technical Library | 2007-12-13 17:03:02.0
Printer-hosted processes for solder ball placement are now widely used for package technologies ranging from BGAs using ball diameters above 750μm to the latest WL-CSPs demanding 250μm diameter. This broadening spectrum of applications brings more choices in terms of stencil design rules and production methodologies.
Parts & Supplies | Soldering - Reflow
Used heating zones blower motors taken out from Heller reflow oven. All fully working. Input: 210-240 V, 50/60 Hz, 0,22 Hp (166 W), 1,1/1A, 2700/3200 Rpm. Impeller diameter: 5 inch. Quantity: 31 pcs. More information upon individual request.
Technical Library | 2015-12-31 15:19:28.0
Today's consumer electronic product are characterized by miniatuization, portability and light weight with high performance, especially for 3G mobile products. In the future more fine pitch CSPs (0.4mm) component will be required. However, the product reliability has been a big challenge with the fine pitch CSP. Firstly, the fine pitch CSPs are with smaller solder balls of 0.25mm diameter or even smaller. The small solder ball and pad size do weaken the solder connection and the adhesion of the pad and substrate, thus the pad will peel off easily from the PCB substrate. In addition, miniature solder joint reduce the strength during mechanical vibration, thermal shock, fatigue failure, etc. Secondly, applying sufficient solder paste evenly on the small pad of the CSP is difficult because stencil opening is only 0.25mm or less. This issue can be solved using the high end type of stencil such as Electroforming which will increase the cost.
Technical Library | 2008-04-08 17:42:27.0
Concern about the failure of lead-free BGA packages when portable devices such as cell phones are accidentally dropped and a general concern about the resistance of these packages under shock loading has prompted an interest in the impact strength of the soldered BGA connection. This paper reports the results of the measurement of the impact strength of lead-free 0.5±0.01mm diameter BGA spheres on 0.42mm solder mask defined pads on copper/OSP and ENIG substrates using recently developed equipment that can load individual BGA spheres at high strain rates in shear and tension.
Silver paste mixing machine is used to mix silver paste or silver aluminum paste,can make to order according to bottle size or bottle weight. Welcome details: sales@jwide-smt.com
This is what the fully assembled How to Solder Kit looks like. Depress the button and one of the LEDs will remain lit at the end (it eventually times out). You can add some kind of template so each LED position has some meaning. The PCB has a real gr
sales5_at_etlimited_cn Halogen free PCB,PCB boards, PCB prototype, pcb solder mask,FREE PCB Key speciafications/special features: 8 layers PCB Base material: Ceramics, Aluminum, Rogers, high Tg, F4B, F4B
Teaching video on PCB through hole repair. BEST instructors teach the method for repair of a damaged eyelet using a multitude of different close up and angled views. Repair is completed per the IPC 7721 instructions. http://www.solder.net
The Thermaltronics Robotic System incorporates innovative design concepts and precision components to ensure accuracy. The combination of high precision hardware and intelligent software ensures precision soldering and low operator training costs.
This powerful soldering system makes the most challenging applications so effortless, take a look! Courtesy of our German distributor Conrad: OKi Metcal Löt- und Rework-System. The MFR-1110 is available on the Metcal webstore and from all our authori
