The G-Titan printer offers Opti-Paste Control (OPC), get ready for lights-out manufacturing! Quality Print Control (QPC) Solder Paste Rolling Measurement Stencil Lock Automatic Solder Paste Dispense FEATURES: Auto Paste Dispensing - Paste
Industry News | 2011-12-01 14:01:34.0
Ersa has expanded its product range by the ECOSELECT 1: a selective soldering machine requiring less than 3 m² of space - thus fitting optimally into cell production environments.
Industry News | 2016-04-12 09:32:03.0
Metcal has announced that it will exhibit in Hall 7, Stand 109 with distributor SmartTec at the upcoming SMT/Hybrid/Packaging show, scheduled to take place April 26-28, 2016 at the Messe in Nuremberg, Germany. Metcal’s Scarab Site Cleaning System (APR-2000-SCS) will be on display, along with the Scorpion Rework System, the MX-5200 Soldering & Rework System, and the soon-to-be-launched Solder Wire Feeder.
Product name: Halogen Free Lead Free Solder Wire Product code: E9650-HF961 Alloy composition: Sn/Ag3.0/Cu0.5 Diameter: 0.2mm, 0.6mm, 0.8mm, 1.0mm, 1.2mm, 1.6mm Packing: 500g/reel, 1kg/reel (10kg/box) Price: Contact us for best price Features:
New Equipment | Solder Paste Stencils
PNC Inc. uses LPKF Laser Technology to manufacture SMT Solder paste stencil, high tolerance aperture openings with superior registration for it’s solder paste stencils. With it’s 4 mil beam diameter, our Laser is capable of cutting small aperture ope
Used SMT Equipment | General Purpose Equipment
FEATHERS The solder paste miser efficiently and evenly mixes the solder paste to a liquid state. It helps to achieve better results of stencil printing and reflowing processes. The use of the mixer also reduces the chances of absorbing air moistur
Used SMT Equipment | Soldering - Wave
Working width: 330 mm (13") Solder module: Type: lead-free double wave solder module Solder volume: approx. 390 kg (860 lb.) LEADFREE approx. 335 kg (739 lb.) lead-free alloy Warm-up time: approx. 2.5 h Preheating length: 1,100 mm (43.3") Fl
Technical Library | 2024-06-23 21:57:16.0
Two extremes of reflow time scale for copper pillar flip chip solder joints were explored in this study. Sn-2.5Ag solder capped pillars were joined to laminate substrates using either conventional forced convection reflow or the controlled impingement of a defocused infrared laser. The laser reflow joining process was accomplished with an order of magnitude reduction in time above liquidus and a similar increase in solidification cooling rate. The brief reflow time and rapid cooling of a laser impingement reflow necessarily affects all time and temperature dependent phenomena characteristic of reflowed molten solder. These include second phase precipitate dissolution, base metal (copper) dissolution, and the extent of surface wetting. This study examines the reflow dependent microstructural aspects of flip chip Sn-Ag joints on samples of two different size scales, the first with copper pillars of 70μm diameter on 120μm pitch and the second with 23μm diameter pillars on a 40μm pitch. The length scale of Pb-free solder joints is known to affect the Sn grain solidification structure; Sn grain morphology will be noted across both reflow time and joint length scales. Sn grain morphology was further found to be dependent on the extent of surface wetting when such wetting circumvented the copper diffusion barrier layer. Microstructural analysis also will include a comparison of intermetallic structures formed; including the size and number density of second phase Ag3Sn precipitates in the joint and the morphology and thickness of the interfacial intermetallics formed on the pillar and substrate surfaces.
Parts & Supplies | Repair/Rework
main features The full-automatic BGA Ball Mounting machine PG-FA6800 is composed of IPC control system, high-speed 12 axis motion control system, high definition Vision inspection system, convenient operation system, and automatic orientation contr
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