Used SMT Equipment | Soldering - Wave
Working width: 330 mm (13") Solder module: Type: lead-free double wave solder module Solder volume: approx. 390 kg (860 lb.) LEADFREE approx. 335 kg (739 lb.) lead-free alloy Warm-up time: approx. 2.5 h Preheating length: 1,100 mm (43.3") Fl
H351 is 5 axis combined controller soldering robot for X,Y,Z,R,and solering wire feeding motion system. User-friendly robot teaching is achieved with a large LCD touch display.Using the block copy function,many other points can easily be entered aft
Industry News | 2020-01-07 11:22:42.0
Seika Machinery, Inc. today announced plans to exhibit at the 2020 IPC APEX EXPO, scheduled to take place Feb. 4-6, 2020 at the San Diego Convention Center in California. Seika will introduce the new PCU-285 Spiral Viscometer and DS-10S Dip Tester for Selective Solder from Malcom in Booth #3645.
New Equipment | Cable & Wire Harness Equipment
Overview Programmable stripping machine for semi-rigid coaxial cables up to 4.50 mm (0.177”) outer diameter and strip lengths up to 30 mm (1.18”). High precision field proven mechanics based on the previous model SemiRigid 1000 User friendl
Technical Library | 2024-06-23 21:57:16.0
Two extremes of reflow time scale for copper pillar flip chip solder joints were explored in this study. Sn-2.5Ag solder capped pillars were joined to laminate substrates using either conventional forced convection reflow or the controlled impingement of a defocused infrared laser. The laser reflow joining process was accomplished with an order of magnitude reduction in time above liquidus and a similar increase in solidification cooling rate. The brief reflow time and rapid cooling of a laser impingement reflow necessarily affects all time and temperature dependent phenomena characteristic of reflowed molten solder. These include second phase precipitate dissolution, base metal (copper) dissolution, and the extent of surface wetting. This study examines the reflow dependent microstructural aspects of flip chip Sn-Ag joints on samples of two different size scales, the first with copper pillars of 70μm diameter on 120μm pitch and the second with 23μm diameter pillars on a 40μm pitch. The length scale of Pb-free solder joints is known to affect the Sn grain solidification structure; Sn grain morphology will be noted across both reflow time and joint length scales. Sn grain morphology was further found to be dependent on the extent of surface wetting when such wetting circumvented the copper diffusion barrier layer. Microstructural analysis also will include a comparison of intermetallic structures formed; including the size and number density of second phase Ag3Sn precipitates in the joint and the morphology and thickness of the interfacial intermetallics formed on the pillar and substrate surfaces.
Industry News | 2019-11-27 01:33:15.0
ULT AG recently introduced the mobile soldering fume extraction unit LRA 160.1 for small and medium air pollutant quantities
The Thermaltronics Robot System incorporates innovative design concepts and precision components to ensure accuracy. The combination of high precision hardware and intelligent software ensures precision soldering and low operator training costs. 8
Industry News | 2024-03-18 13:35:10.0
Kurtz Ersa Inc. today announced that it received a 2024 CIRCUITS ASSEMBLY NPI (New Product Introduction) Award in the category of Soldering - Selective for its VERSAFLOW ONE X-Series.
Industry Directory | Consultant / Service Provider / Manufacturer
Print perfect smt stencils with post-reflow success.
MDE Semiconductor, Inc. is a market leader in Circuit Protection Products.
