Electronics Forum | Thu Apr 17 13:00:28 EDT 2003 | Takfire
Russ, The caps are 0603 case size. I am not sure about the manufacturing details, as I work for the capacitor supplier. The manufacturing details are unclear at the moment, as the customer (South of the border) has not released such detailed inform
Electronics Forum | Wed Jul 09 09:27:02 EDT 2003 | MA/NY DDave
Hi Saw a Cross Section picture and thought of you You noted above that you couldn't find any pictures or descriptions of your problem in a few well known sources. It probably is not what you are experiencing yet a soldering defect called land lift
Electronics Forum | Wed Apr 16 11:20:31 EDT 2003 | russ
What was the original complaint? when you say solder wicked onto top of capacitor do you mean it was dewetted from the board and only on the cap? What type of device showed voiding? how bad was it 20%,50%? I have found that the paste type seems to
Electronics Forum | Thu Apr 17 14:14:17 EDT 2003 | davef
Takfire Questions are: * Why does your customer think the capacitor is the issue? [What are we thinking? Of course the capacitor is causing this voiding problem. What else could it be?] * What are the type, construction, end-cap material and plati
Electronics Forum | Thu Jul 03 13:10:39 EDT 2003 | slthomas
I snapped a board in half at a cracked solder joint, and the component pulled free of the solder and still has a very thin layer of metal on the termination end. Based on the construction spec.(solder over nickel over palladium), it looks like it
Electronics Forum | Fri Jul 04 08:57:59 EDT 2003 | davef
If you think you have an intermetallic, soldering as probably done correctly. In that case, expect the solder to fail in the solder, just above the intermetallic. This the weakest portion of the solder, because the tin has be depleted to form the i
Electronics Forum | Wed Jul 09 18:02:48 EDT 2003 | slthomas
Just when you think you're getting somewhere... QA sent me a vendor response to our corrective action request. They stated that their normal process for this product includes an ultrasonic cleaning cycle of 20 MINUTES minimum. It might be 30, we'r
Electronics Forum | Mon Jul 14 16:26:58 EDT 2003 | slthomas
Yes, they do the cleaning, we did the (apparently first) inspection and caught the problems. They tried a shorter cleaning cycle, witnessed no defects, and attributed the defects on the boards we had to their cleaning process. Now they just plan on
Electronics Forum | Tue Jul 15 11:18:29 EDT 2003 | slthomas
It is an interesting situation....one that merits as much business philosophy analysis as technical analysis. I'll be getting my official 60 day notice today. Any criticism about our overseas suppliers (that were selected by sr. management w/o in
Electronics Forum | Thu Jul 03 12:03:00 EDT 2003 | slthomas
So, there is a crack or gap between: * Solder and component termination. Bingo Correct? Describe: * Coarseness / smoothness of the metal on the termination underneither the crack. * Solder left on the termination. Unfortunately at 45X I can't rea
