Full Site - : solder fillet (Page 4 of 70)

Surface Mount Technology

Career Center | Oakville, Ontario Canada | Engineering,Production,Quality Control

Technicians / Technologists To help us continue setting the pace in a rapidly changing manufacturing environment, we need people to operate state of the art manufacturing equipment, perform failure analysis and quality inspection on a wide variety

XLTEK

Side Wettable Flanks for Leadless Automotive Packaging

Technical Library | 2023-08-04 15:38:36.0

The MicroLeadFrame® (MLF®)/Quad Flat No-Lead (QFN) packaging solution is extremely popular in the semiconductor industry. It is used in applications ranging from consumer electronics and communications to those requiring high reliability performance, such as the automotive industry. The wide acceptance of this packaging design is primarily due to its flexible form factors, size, scalability and thermal dissipation capabilities. The adaptation and acceptance of MLF/QFN packages in automotive high reliability applications has led to the development of materials and processes that have extended its capabilities to meet the performance and quality requirements. One of process developments that is enabling the success of the MLF/QFN within the automotive industry has been the innovation of side wettable flanks that provide the capability to inspect the package lead to printed circuit board (PCB) interfaces for reliable solder joints. Traditionally, through-board X-ray was the accepted method for detecting reliable solder joints for leadless packages. However, as PBC layer counts and routing complexities have increased, this method to detect well-formed solder fillets has proven ineffective and incapable of meeting the inspection requirements. To support increased reliability and more accurate inspection of the leadless package solder joints, processes to form side-wettable flanks have been developed. These processes enable the formation of solder fillets that are detectable using state-of-the-art automated optical inspection (AOI) equipment, providing increased throughput for the surface mount technology (SMT) processes and improved quality as well.

Amkor Technology, Inc.

Saki BF-Planet-X

Used SMT Equipment | AOI / Automated Optical Inspection

SAKY BF-PLANET-X With a superior resolution of 10μm and scanning line color CCD camera, both AOI system provide accurate and stable inspection results. Solder fillets on components as small as the high density mounted 01005(0402) chip, as well a

SMTVYS

Pin In Hole, Pin in Paste or Selective Reflow CD from Bob Willis

Industry News | 2017-01-18 05:21:35.0

This photo CD ROM provides the process or quality engineer with a source of PIHR photographs of the assembly process, components and process defects which may be used in company inspection document or training presentations. They may be simply pasted into any document for in house company use. Now over 250 photographs are provided in either jpg or tif file format for use in PowerPoint, Word inspection standards or online publications royalty free http://www.bobwillis.co.uk/product-category/photo-cd-rom/

ASKbobwillis.com

Whisker Formation Induced by Component and Assembly Ionic Contamination

Technical Library | 2023-02-13 18:56:42.0

This paper describes the results of an intensive whisker formation study on Pb-free assemblies with different levels of cleanliness. Thirteen types of as-received surface-mount and pin-through-hole components were cleaned and intentionally contaminated with solutions containing chloride, sulfate, bromide, and nitrate. Then the parts were assembled on double-sided boards that were also cleaned or intentionally contaminated with three fluxes having different halide contents. The assemblies were subjected to high-temperature/high-humidity testing (85_C/85% RH). Periodic examination found that contamination triggered whisker formation on both exposed tin and solder fillets. Whisker occurrence and parameters depending on the type and level of contamination are discussed. Cross-sections were used to assess the metallurgical aspects of whisker formation and the microstructural changes occurring during corrosion.

Celestica Corporation

Marantz M22XDL460

Marantz M22XDL460

Used SMT Equipment | AOI / Automated Optical Inspection

Offered systems: 2 x Configurations, consisted from: M22XDL460 AOI ,Power Mac G5 PC, Monitor 17” Vantage: 2006 Condition: good. Marantz Aoi Systems •Automatic Optical Inspection of PCB’s •Inspects: SMT & THT Components (presence, type, polari

Fix Trade BV

Marantz M22XDL460 AOI System

Marantz M22XDL460 AOI System

Used SMT Equipment | AOI / Automated Optical Inspection

Offered systems: 2 x Configurations, consisted from: M22XDL460 AOI ,Power Mac G5 PC, Monitor 17” Vantage: 2006 Condition: good. Marantz Aoi Systems •Automatic Optical Inspection of PCB’s •Inspects: SMT & THT Components (presence, type, polari

Fix Trade BV

TR7500QE - 3D Automated Optical Inspection System

Videos

The TR7500QE AOI offers high performance 3D solder and assembly inspection by combining the next generation multi-angle 2D and 3D technologies based on 4-way adaptive digital fringe pattern projection and 4 side view cameras. Latest inspection softwa

TRI - Test Research, Inc. USA

TR7700QE 3D Automated Optical Inspection Solution

Videos

The TR7700QE AOI offers high performance 3D solder and assembly inspection by combining the next generation 2D and 3D technologies based on 4-way adaptive digital fringe pattern projection. Latest inspection software ensures quick CAD-based programmi

TRI - Test Research, Inc. USA

Saki BF-Frontier II

Saki BF-Frontier II

Used SMT Equipment | AOI / Automated Optical Inspection

2010 SAKI BF-Frontier II AOI 100% Operational / Tested 18μm and scanning line color CCD camera Board size 2x2.4in. to 18x20 in. Inspection of (presence/absence, misalignment, tombstoning, reverse polarity, bridging, foreign material,

G-Force Technical, Ltd.


solder fillet searches for Companies, Equipment, Machines, Suppliers & Information

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