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Assessing the Effectiveness of I/O Stencil Aperture Modifications on BTC Void Reduction

Technical Library | 2018-09-26 20:33:26.0

Bottom terminated components, or BTCs, have been rapidly incorporated into PCB designs because of their low cost, small footprint and overall reliability. The combination of leadless terminations with underside ground/thermal pads have presented a multitude of challenges to PCB assemblers, including tilting, poor solder fillet formation, difficult inspection and – most notably – center pad voiding. Voids in large SMT solder joints can be difficult to predict and control due to the variety of input variables that can influence their formation. Solder paste chemistries, PCB final finishes, and reflow profiles and atmospheres have all been scrutinized, and their effects well documented. Additionally, many of the published center pad voiding studies have focused on optimizing center pad footprint and stencil aperture designs. This study focuses on I/O pad stencil modifications rather than center pad modifications. It shows a no-cost, easily implemented I/O design guideline that can be deployed to consistently and repeatedly reduce void formation on BTC-style packages.

AIM Solder

Beyond 0402M Placement: Process Considerations for 03015M Microchip Mounting

Technical Library | 2015-05-28 17:34:48.0

The printed circuit board assembly industry has long embraced the "Smaller, Lighter, Faster" mantra for electronic devices, especially in our ubiquitous mobile devices. As manufacturers increase smart phone functionality and capability, designers must adopt smaller components to facilitate high-density packaging. Measuring over 40% smaller than today's 0402M (0.4mmx0.2mm) microchip, the new 03015M (0.3mm×0.15mm) microchip epitomizes the bleeding-edge of surface mount component miniaturization. This presentation will explore board and component trends, and then delve into three critical areas for successful 03015M adoption: placement equipment, assembly materials, and process controls. Beyond machine requirements, the importance of taping specifications, component shape, solder fillet, spacing gap, and stencil design are explored. We will also examine how Adaptive Process Control can increase production yields and reduce defects by placing components to solder position rather than pad. Understanding the process considerations for 03015M component mounting today will help designers and manufacturers transition to successful placement tomorrow.

Panasonic Factory Solutions Company of America (PFSA)

IPC-A-610 Certified IPC Trainer (CIT) Course

Training Courses | | | IPC-A-610 Trainer (CIT)

The Certified IPC-A-610 Trainer (CIT) courses recognize individuals as qualified trainers in the area of quality assurance of electrical and electronic assemblies and prepares them to deliver Certified IPC-A-610 (CIS) training.

Circuit Technology Inc.

IPC-A-610 Trainer (CIT) Certification Training Course

Training Courses | | | IPC-A-610 Trainer (CIT)

The Certified IPC-A-610 Trainer (CIT) courses recognize individuals as qualified trainers in the area of quality assurance of electrical and electronic assemblies and prepares them to deliver Certified IPC-A-610 (CIS) training.

Verion Training Systems, LLC

IPC-A-610 Trainer (CIT) Recertification Course

Training Courses | | | IPC-A-610 Trainer (CIT) Recert.

The Certified IPC-A-610 Trainer (CIT) recertification courses are intended for those individuals who were previously accredited to provide Certified IPC-A-610 Specialist (CIS) training.

Verion Training Systems, LLC

Manncorp Sherlock 300 Benchtop AOI

Manncorp Sherlock 300 Benchtop AOI

Used SMT Equipment | AOI / Automated Optical Inspection

This AOI was purchased for $49,995 from Manncorp.  The Sherlock AOI is in excellent condition and has under 200 hours of usage.   The Sherlock AOI Systems detect a comprehensive range of defects and errors in PCB assembly using the Sherlock PCB ins

Nelson Specialties Company

DH-A2 automatic BGA rework station for computer and mobile phone repairing

DH-A2 automatic BGA rework station for computer and mobile phone repairing

Videos

Dinghua Technology-- the leading manufacturer of BGA rework station, Automatic screw locking machine, Automatic soldering station and non-standard equipment. For more details, please just contact John, WhatsApp/Wechat:+86 1576811 4827 , Skype: si

Shenzhen Dinghua Technology Development Co., Ltd.

SN100c Lead-Free Bar Solder

SN100c Lead-Free Bar Solder

New Equipment | Solder Materials

FCT Assembly has partnered with Nihon Superior to be able to offer their patented lead free nickel stabilized tin/copper wave solder alloy- SN100C in North America. SN100C was developed to offer a technically superior and more economical option to th

FCT ASSEMBLY, INC.

Omron VT-RNS2-L3

Omron VT-RNS2-L3

Used SMT Equipment | AOI / Automated Optical Inspection

R Front Rail Fixed Application Version: 7.20C (RNS) Ladder Version: 7.100B (RNS) Image Resolution: 15um AC 120V, 2 Phase, 50/60 Hz, 1.5 kVA Max Current: 15A Hardware Configuration: Image Signal Input Unit: - Camera: 3-CCD Camera - Illumi

Tekmart International Inc.

IPC-A-610 Trainer (CIT) Certification Training Course

Training Courses | | | IPC-A-610 Trainer (CIT)

The Certified IPC-A-610 Trainer (CIT) courses recognize individuals as qualified trainers in the area of quality assurance of electrical and electronic assemblies and prepares them to deliver Certified IPC-A-610 (CIS) training.

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