New Equipment | Solder Materials
Solder additive to aid in reducing the solder dross buildup in both static and wave soldering pots containing SN100c. AO1000 can reduce solder usage by as much as 50%. FCT Assembly has developed AO1000 Anti-Oxidant Solder Additive to aid in reducin
Technical Library | 2018-09-26 20:33:26.0
Bottom terminated components, or BTCs, have been rapidly incorporated into PCB designs because of their low cost, small footprint and overall reliability. The combination of leadless terminations with underside ground/thermal pads have presented a multitude of challenges to PCB assemblers, including tilting, poor solder fillet formation, difficult inspection and – most notably – center pad voiding. Voids in large SMT solder joints can be difficult to predict and control due to the variety of input variables that can influence their formation. Solder paste chemistries, PCB final finishes, and reflow profiles and atmospheres have all been scrutinized, and their effects well documented. Additionally, many of the published center pad voiding studies have focused on optimizing center pad footprint and stencil aperture designs. This study focuses on I/O pad stencil modifications rather than center pad modifications. It shows a no-cost, easily implemented I/O design guideline that can be deployed to consistently and repeatedly reduce void formation on BTC-style packages.
New Equipment | Test Equipment
SAKI AOI BF-Frontier II Resolution 18μm Board size:460×500mm Dimension:850 × 1340 × 1230mm weight:450kg Product description: SAKI AOI BF-Frontier II, Resolution 18μm, Board size:460×500mm, Dimension:850 ×
New Equipment | Test Equipment
SAKI AOI BF-Frontier II Resolution 18μm Board size:460×500mm Dimension:850 × 1340 × 1230mm weight:450kg Product description: SAKI AOI BF-Frontier II, Resolution 18μm, Board size:460×500mm, Dimension:850 ×
Technical Library | 2015-05-28 17:34:48.0
The printed circuit board assembly industry has long embraced the "Smaller, Lighter, Faster" mantra for electronic devices, especially in our ubiquitous mobile devices. As manufacturers increase smart phone functionality and capability, designers must adopt smaller components to facilitate high-density packaging. Measuring over 40% smaller than today's 0402M (0.4mmx0.2mm) microchip, the new 03015M (0.3mm×0.15mm) microchip epitomizes the bleeding-edge of surface mount component miniaturization. This presentation will explore board and component trends, and then delve into three critical areas for successful 03015M adoption: placement equipment, assembly materials, and process controls. Beyond machine requirements, the importance of taping specifications, component shape, solder fillet, spacing gap, and stencil design are explored. We will also examine how Adaptive Process Control can increase production yields and reduce defects by placing components to solder position rather than pad. Understanding the process considerations for 03015M component mounting today will help designers and manufacturers transition to successful placement tomorrow.
Training Courses | | | IPC-A-610 Trainer (CIT)
The Certified IPC-A-610 Trainer (CIT) courses recognize individuals as qualified trainers in the area of quality assurance of electrical and electronic assemblies and prepares them to deliver Certified IPC-A-610 (CIS) training.
Training Courses | | | IPC-A-610 Trainer (CIT)
The Certified IPC-A-610 Trainer (CIT) courses recognize individuals as qualified trainers in the area of quality assurance of electrical and electronic assemblies and prepares them to deliver Certified IPC-A-610 (CIS) training.
Training Courses | | | IPC-A-610 Trainer (CIT) Recert.
The Certified IPC-A-610 Trainer (CIT) recertification courses are intended for those individuals who were previously accredited to provide Certified IPC-A-610 Specialist (CIS) training.
Used SMT Equipment | AOI / Automated Optical Inspection
This AOI was purchased for $49,995 from Manncorp. The Sherlock AOI is in excellent condition and has under 200 hours of usage. The Sherlock AOI Systems detect a comprehensive range of defects and errors in PCB assembly using the Sherlock PCB ins
Key Factor 1: Advanced Hardware Features Proprietary Hardware provides accurate measurements Saki's machines are built with hardware that's made to last. A closed-loop, dual servo motor drive system, high-resolution linear scale, and rigid gant
.png)
