Industry News | 2011-03-14 17:59:18.0
Nihon Superior Co. Ltd. will exhibit in Booth #259 at the upcoming IPC APEX EXPO, scheduled to take place April 12-14, 2011 at the Mandalay Bay Resort & Convention Center in Las Vegas.
Industry News | 2024-04-22 10:17:25.0
Apollo Seiko, a leading innovator in soldering technology, is pleased to announce its participation in the upcoming Electrical Wire Processing Technology Expo (EWPTE), taking place May 15-16, 2024 in Milwaukee, WI. The company will showcase its J-CAT LYRA Desktop Soldering Robot in Booth 406.
Industry News | 2018-05-14 09:06:17.0
Under the slogan “True 3D Smart Factory solutions powered by the AI platform,” Koh Young Technology will exhibit in Hall 4A, Booth 233, at the upcoming SMT Hybrid Packaging show scheduled for June 5-7, 2018 at the Messe in Nuremberg, Germany. The company will display the next-generation Zenith2 3D AOI, new KY-P3 3D pin inspection solution, and the new automated solder dispensing feature on its KY8030-3 3D SPI.
Industry News | 2018-05-14 09:06:21.0
Under the slogan “True 3D Smart Factory solutions powered by the AI platform,” Koh Young Technology will exhibit in Hall 4A, Booth 233, at the upcoming SMT Hybrid Packaging show scheduled for June 5-7, 2018 at the Messe in Nuremberg, Germany. The company will display the next-generation Zenith2 3D AOI, new KY-P3 3D pin inspection solution, and the new automated solder dispensing feature on its KY8030-3 3D SPI.
Industry News | 2009-09-17 15:06:04.0
OSAKA, JAPAN — September 2009 — Nihon Superior Co. Ltd., an advanced soldering and brazing supplier to the worldwide market, announces that it will showcase a new, expanded range of SN100C products in booth 624 at the upcoming SMTA International, scheduled to take place October 6-7, 2009 at The Town and Country Resort and Convention Center in San Diego, CA.
Industry News | 2013-02-21 07:01:08.0
AIM Solder today announced that it has been awarded a 2013 NPI Award in the category of Flux for its NC277 No-Clean Liquid Flux.
Industry News | 2012-01-13 13:20:53.0
Zymet has introduced a new reworkable underfill encapsulant, CN-1736, designed to underfill 0.4-mm pitch Package-on-Package (POP) assemblies. It has low viscosity and a lower CTE than its predecessors. Plus it has greater flux compatibility, making it suitable for use with a broader range of solderpastes and tacky fluxes.
Industry News | 2012-01-21 16:28:10.0
Nihon Superior will introduce the newest addition to its SN100C lead-free solder series in Booth #3044 at the upcoming IPC APEX Expo, scheduled to take place February 28 - March 1, 2012 at the San Diego Convention Center in California.
Industry News | 2003-04-07 11:00:15.0
The innovative VPI-1000 optical inspection system is the only benchtop SMT inspection system capable of inspecting BGA devices as standard, without necessitating a lengthy lens reconfiguration.
Industry News | 2011-09-01 21:35:02.0
Nihon Superior (Singapore) Pte. Ltd., subsidiary of Nihon Superior Co. Ltd. will showcase a new, expanded range of SN100C products in booth 1060 at the upcoming Productronica India 2011 exhibition
