1153 solder in the contact are of gold edge connector contact lands is considered results

SMT Express, Volume 2, Issue No. 3 - from SMTnet.com

Drop Impact Reliability of Edge-bonded Lead-free Chipscale Packages

Drop Impact Reliability of Edge-bonded Lead-free Chipscale Packages Drop Impact Reliability of Edge-bonded Lead-free Chipscale Packages This paper presents the drop test reliability results for edge-bonded 0.5mm pitch lead-free chip scale

The Last Will And Testament of the BGA Void

Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf

infinity. A shape factor of less than 1.0 is generally considered to be indicative of infant mortality. Electronic components in thermal cycling that are undergoing ‘post infant mortality’ failures typically exhibit shape factors in the range of 4-8

Heller Industries Inc.

Journal of SMT Articles

Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm

TECHNOLOGY IN PORTABLE ELECTRONICS Arni Kujala Abstract 15-2 STACKED MULTI-CHIP PACKAGING FOR THE NEXT GENERATION ELECTRONICS Vern Solberg Abstract 15-2 ELECTRICAL CHARACTERIZATION OF LEAD-FREE SOLDER SEPARABLE CONTACT INTERFACES Ji Wu and Michael Pecht

Surface Mount Technology Association (SMTA)