Full Site - : solder joint arnish reflow (Page 7 of 181)

Volunteers Honored for Contributions to IPC and Electronics Industry Fifty Awards Presented at IPC APEX EXPO�

Industry News | 2009-04-15 23:12:38.0

BANNOCKBURN, Ill., USA, April 1, 2009 � IPC � IPC � Association Connecting Electronics Industries� presented Special Recognition, Distinguished Committee Leadership and Distinguished Committee Service awards at IPC APEX EXPO 2009, held March 31�April 2 in Las Vegas.

Association Connecting Electronics Industries (IPC)

Webtorial: Design and Assembly Process Challenges for Bottom Terminations Components (BTCs) such as QFN, DFN and MLF in Tin-Lead & Lead Free World

Industry News | 2013-01-02 16:01:34.0

A Convenienient and informative online tutorial about Design and Assembly Process Challenges for Bottom Terminations Components

Surface Mount Technology Association (SMTA)

Innovative Technology Center at IPC APEX EXPO Highlights Leading Edge Technologies.

Industry News | 2010-03-27 19:26:29.0

BANNOCKBURN, Ill., USA, - IPC - Association Connecting Electronics Industries® announces the products that will be featured in the Innovative Technology Center (ITC) at IPC APEX EXPO™, April 6–8, 2010, in Las Vegas. Assessed by an IPC Review Board of industry experts, the products were selected based on their representation of a new or emerging technology of significant value and relevance to the electronics manufacturing industry.

Association Connecting Electronics Industries (IPC)

A Look to the Future in the Electronics Industry at IPC APEX EXPO® 2013

Industry News | 2013-01-19 07:46:16.0

Information that inspires innovation is center-stage for design, printed boards, electronics assembly, test and printed electronics

Association Connecting Electronics Industries (IPC)

LED Factory Upgrade Driven By The Belt and Road Environment

Industry News | 2023-07-22 06:07:51.0

Revamp your LED factory with the Belt and Road environment in mind. Embrace innovation and sustainability as you upgrade your LED production capabilities. Explore how the Belt and Road initiative is driving positive changes in the LED industry, and stay ahead in the global market with our advanced solutions.

I.C.T ( Dongguan Intercontinental Technology Co., Ltd. )

These are the instructions for the BEST Heatshields(TM) an effective, high tech simple way to shield heat sensitive components during reflow/rework.

These are the instructions for the BEST Heatshields(TM) an effective, high tech simple way to shield heat sensitive components during reflow/rework.

Videos

These are the instructions for the BEST Heatshields(TM) an effective, high tech simple way to shield heat sensitive components during reflow/rework. This ceramic-based non-woven material, when properly deployed, will protect components so that they d

BEST Inc.

HeatShieldGel(TM)

HeatShieldGel(TM)

Videos

To order, visit http://www.solder.net/products/heatshieldgel-tm/ BEST HeatShield Gel™ is a thermal shield water-based gel designed to be used in the PCB rework/repair or board assembly areas in order to provide thermal protection of electronic compo

BEST Inc.

Lead-Free BGA Rework-Transition Issues

Technical Library | 2007-08-16 13:34:31.0

While experienced inspectors may be able to determine the aesthetic differences between a lead-free PCB assembly and a tin-lead version, one cannot rely on the "experienced eye". "Less wetting out to the pad edges" (Figure A) and "graininess and lack of shininess of the solder joint" (Figure B) are typical comments about some lead-free solder joints. However, in cases where a Nitrogen atmosphere was present during the reflow of the solder joint (Figure C), there will be little visual differences between the lead free alloys and their tin-lead counterparts.

BEST Inc.

QFN Rework Using Polyimide Stencil

QFN Rework Using Polyimide Stencil

Videos

Video demonstrates easy to use leadless device rework process using polyimide stencil. This is the process described in IPC 7711/21 Procedure 5.8.1.1. and 5.8.1.2. For More Information Visit Our Site: http://www.solder.net/services/qfn-rework For

BEST Inc.

Sn-3.0Ag-0.5Cu/Sn-58Bi composite solder joint assembled using a low-temperature reflow process for PoP technology

Technical Library | 2021-01-13 21:34:29.0

Package-on-Package (PoP) is a popular technology for fabricating chipsets of accelerated processing units. However, the coefficient of thermal expansion mismatch between Si chips and polymer substrates induces thermal warpage during the reflow process. As such, the reflow temperature and reliability of solder joints are critical aspects of PoP. Although Sne58Bi is a good candidate for low-temperature processes, its brittleness causes other reliability issues. In this study, an in-situ observation was performed on composite solders (CSs) made of ...

Osaka University


solder joint arnish reflow searches for Companies, Equipment, Machines, Suppliers & Information

Best SMT Reflow Oven

World's Best Reflow Oven Customizable for Unique Applications
ISVI High Resolution Fast Speed Industrial Cameras

Training online, at your facility, or at one of our worldwide training centers"
Fluid Dispensing, Staking, TIM, Solder Paste

Nozzles, Feeders, Spare Parts - Siemens, Fuji, Juki, Yamaha, etc...
Pillarhouse USA for Selective Soldering Needs

Easily dispense fine pitch components with ±25µm positioning accuracy.