Electronics Forum | Thu Apr 05 12:45:45 EDT 2001 | Claude_Couture
On mixed technology PCBs, we find numerous blow holes on the solder joints of radial parts (electrolytics, LEDs, etc). The solution that works so far is to cut the leads very long in the radial inserter so that the part is kinda loose and the air in
Electronics Forum | Fri Apr 06 16:19:12 EDT 2001 | davef
We build a mixed tech [eg, QFP, SMT fly shit, DIP] board where we can't clinch the DIP. So we set the clinch and cut on the DIP to just barely clinch, leaving the leads very perpendicular to the board. I wonder if you could do something similar wit
Industry News | 2013-10-28 14:45:08.0
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Technical Library | 2015-11-19 18:15:07.0
The move to lead free (Pb-free) electronics by the commercial industry has resulted in an increasing number of ball grid array components (BGAs) which are only available with Pb-free solder balls. The reliability of these devices is not well established when assembled using a standard tin-lead (SnPb) solder paste and reflow profile, known as a backward compatible process. Previous studies in processing mixed alloy solder joints have demonstrated the importance of using a reflow temperature high enough to achieve complete mixing of the SnPb solder paste with the Pb-free solder ball. Research has indicated that complete mixing can occur below the melting point of the Pb-free alloy and is dependent on a number of factors including solder ball composition, solder ball to solder paste ratio, and peak reflow times and temperatures. Increasing the lead content in the system enables full mixing of the solder joint with a reduced peak reflow temperature, however, previous research is conflicting regarding the effect that lead percentage has on solder joint reliability in this mixed alloy solder joint.
Technical Library | 2021-08-25 16:28:36.0
In this study, a Sn–Bi composite solder paste with thermosetting epoxy (TSEP Sn–Bi) was prepared by mixing Sn–Bi solder powder, flux, and epoxy system. The melting characteristics of the Sn–Bi solder alloy and the curing reaction of the epoxy system were measured by differential scanning calorimeter (DSC). A reflow profile was optimized based on the Sn–Bi reflow profile, and the Organic Solderability Preservative (OSP) Cu pad mounted 0603 chip resistor was chosen to reflow soldering and to prepare samples of the corresponding joint. The high temperature and humidity reliability of the solder joints at 85 #14;C/85% RH (Relative Humidity) for 1000 h and the thermal cycle reliability of the solder joints from
SMTnet Express, November 19, 2015, Subscribers: 23,763, Members: Companies: 14,760, Users: 39,366 HALT Testing of Backward Soldered BGAs on a Military Product B. Gumpert, B. Fox, L. Woody; Lockheed Martin Corporation The move to lead free (Pb
SMTnet Express July 25, 2013, Subscribers: 34972, Members: Companies: 13435, Users: 34972 Using Automated 3D X-Ray Inspection to Detect BTC Defects by Barbara Koczera; Test Research USA , An Qi Zhao; Flextronics Detecting marginal joints and other
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/webinars.cfm
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PCB Libraries, Inc. | https://www.pcblibraries.com/forum/advice-for-solder-mask-paste-mask-layers_topic484_page1.html
. Now, if the solder mask and paste mask are 1:1 scale we must have special notes on the fabrication and assembly drawings with instructions for mask adjustments or otherwise we won't get what we want
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