Industry News | 2015-05-18 11:59:19.0
SPOKANE VALLEY, WA –May 18th, 2015– RPS Automation LLC has begun production of three Anthem Lead Tinning Systems in the wake of the 2015 IPC APEX EXPO. Global Engineering and Esterline Leach International are new customers to RPS Automation and chose their Anthem model over many other options as their first Lead Tinning System, while Plexus Peneng is continuing their patronage to RPS with this recent purchase. These consecutive orders show the growing demand for Lead Tinning capabilities and demonstrate RPS Automation’s ability to meet them.
Industry News | 2011-11-20 13:48:27.0
The Balver Zinn Group and Cobar Europe BV announces that it has been awarded a Global Technology Award in the Flux Materials category for its SCAN-Ge071-XF3+ solder paste.
Industry News | 2020-12-10 14:12:04.0
High temperature thin film resistors with an operating temperature up to 215 °C, provide high precision, tight TCR, and excellent stability
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
Electronics Forum | Tue Nov 04 12:58:17 EST 2008 | smt123
I have to agree with Patrick here. This image appears to show a board that is NOT HASL as there is what appears to be a copper pad in the upper portion of the image. But then again the arrow tip appears to be white and I woudl expect that to be red s
Electronics Forum | Thu Sep 11 02:54:27 EDT 2008 | cobar
The 2 % is Ag.It is added to prevent leaching silver from the end caps of components.This alloy like 63/37 is eutectic and has a reflow temp of 179�C whereas 63/37 is 183�C.
Electronics Forum | Thu Jun 22 16:59:18 EDT 2000 | Lee
I'll be real brief, because of time, but feel free to contact me later (lgoldberg@chipcenter.com). There is big conceren (somewhat well-founded but a bit overblown) about lead form electronics products leaching into the environment when they are land
Electronics Forum | Sun Aug 15 05:45:15 EDT 1999 | Brian
Boca, Dave Sorry, but I cannot let this go. I'll go along with you that, at the time that the Montreal Protocol was initially signed (September 1987), there was no scientific proof that CFCs etc. were causing ozone depletion. There was, however, ve
Electronics Forum | Thu Dec 16 16:28:51 EST 2004 | Indy
Hi, We are using Sn/3.0Ag/0.5Cu solder paste on Pd/Ag pad metallization in one of our application. Could someone provide me information on the following: 1. How bad is the Leaching of Ag in SAC alloy and how it can be mitigated. 2. During reflow so
Electronics Forum | Tue Nov 21 09:46:19 EST 2006 | jax
I assume you are talking about Sn62Pb36Ag2 solder. You should not see any added concerns when subjecting Sn62 to multiple reflow cycles as compared to Sn63. As compared to Sn63Pb37: Reduced leaching issues Increased Wetting due to lo
