Electronics Forum | Thu May 09 15:30:57 EDT 2002 | TomN
I'd be a more than a little cautious about doing this. Had a somewhat different application once and found out that as the solution was cleaning/etching the surface, it also leached (thru the lead frame) into the body of the part. What we thought w
Electronics Forum | Tue Apr 09 05:36:27 EDT 2002 | lhudson1
Silver in the paste is present to minimise any negative effects of silver in the pcb finish or component terminations. 2% Ag prevent silver leaching thus giving a more reliable joint.
Electronics Forum | Fri Jul 14 14:05:55 EDT 2006 | nodlac
Additional to Dave F.... A potato has Iron @ 2.75mg and Magnesium @ 55mg. The leaching of these two meatls could contaminate the solder pot and taint the solder. ----------------------- Additional to my additional..THE SOLDER POT POTATO BATTERY...A p
Electronics Forum | Tue Apr 19 16:20:05 EDT 2016 | davef
Don't blame it on the poor paste thickness requirement [although I might go on to argue that it's could be a contributor to the issue]. Most likely you're the problem. About 70% of the time solder on gold fingers is caused by poor cleaning of screen
Electronics Forum | Thu Feb 27 16:23:37 EST 2020 | dwl
http://www.circuitnet.com/news/uploads/3/Comparing-Soldering-Results-of-ENIG-and-EPIG-Post-Steam-Exposure.pdf Years ago, I battled this problem. ENIG PCBs reflowed with active WS flux. We built one side, and then washed them because they were going
Electronics Forum | Fri Apr 25 14:56:40 EDT 2003 | razor
Please explain the phenomenon of solder leaching on SMD end caps. What is the root cause? What is the best control method?
Electronics Forum | Sat Feb 28 18:09:49 EST 2004 | Indraneel
Hi, I am having some problem during reflow of solder paste. There seems to be leaching of solder paste. Can anyone let me know some solutions to minimize it . Rgds Indraneel
Electronics Forum | Sat Feb 28 20:26:00 EST 2004 | Ken
Can you give some more detail to your problem? What eactly are you seeing?
Electronics Forum | Wed Jun 07 11:25:23 EDT 2000 | Dave F
In the portion of Chapter 1 on Flip Chips, Ken Gallio states (1.8.2.1) "tin/lead solder leaching or dissolving gold and form metal compounds, called dendrites, that greatly reduce joint reliability because of high brittleness." What is the compositi
Electronics Forum | Fri Apr 25 17:03:34 EDT 2003 | davef
Leaching. Dissolution of a metal coating into liquid solder. Leaching applies to liquid solder and, at times, is applied inaccurately to metallurgical effects, like diffusion, that occur after the solder has solidified. Please help us understand y
