Electronics Forum | Thu Jul 01 20:56:57 EDT 1999 | Dave F
| | | | | Could somebody tell me what means Leaching, ie: "Leaching of terminal end face exposing the ceramic"? | | | | | | | | | Roberto: Leaching, according to the SMTnet Library of Terms: | | | | | | | | Leaching. Dissolution of a metal coating
Electronics Forum | Thu Dec 22 10:37:05 EST 2005 | mark
Pete is correct. Lead from the "Leaded" parts will leach into the solder pot and eventually the Pot will become contaminated with unacceptable levels of lead. At that point the entire pot will have to be emptied and cleaned. NOT a fun thing to do!!
Electronics Forum | Thu Jun 08 07:56:34 EDT 2017 | jkitt84
In an excellent previous thread davef mentions brass should be plated prior to soldering to prevent zinc leaching from the brass. It is reported once the zinc leaches, the joint is weak. He recommends copper or nickel plating. Would silver plating w
Electronics Forum | Wed Dec 15 10:37:55 EST 2004 | gopinath A
Thanks Dave, That answers my question. I didn't think either that the qty of gold in platings would be enough to contaminate the solder pot. I wanted to make sure that leach test is a valid test for gold finishes. Gopinath@mcl.com
Electronics Forum | Tue Jun 29 18:35:59 EDT 1999 | JohnW
| | Could somebody tell me what means Leaching, ie: "Leaching of terminal end face exposing the ceramic"? | | | Roberto: Leaching, according to the SMTnet Library of Terms: | | Leaching. Dissolution of a metal coating into liquid solder. Nickel ba
Electronics Forum | Wed Apr 07 08:28:41 EDT 2004 | Dougie
Hi, We are Scottish manufacturing company considering a move to Immersion Silver finished PWB's from HASL. The driver behind it being the RoHS and WEEE legislation in Europe at present. My question is... We plan on using a Sn/Cu/Ni solder bar in o
Electronics Forum | Wed Apr 07 08:30:22 EDT 2004 | Dougie
Hi, We are Scottish manufacturing company considering a move to Immersion Silver finished PWB's from HASL. The driver behind it being the RoHS and WEEE legislation in Europe at present. My question is... We plan on using a Sn/Cu/Ni solder bar in o
Electronics Forum | Sat Aug 15 13:26:05 EDT 1998 | Bob Willis
| Electrical Eng. is looking for 5 micrograms per sq centimeter. After the board has been cleaned. Is this possible on a fully assembled bd? The European standard often quoted is 1.5 mg/cm which ia achievable on a board assembly please remember one
Electronics Forum | Tue Aug 30 12:49:59 EDT 2005 | Ted
Slaine, We use a Pd/Ag thickfilm paste. Because of the leaching we had to start using solder pastes that have silver in it. For RoHS, we are using a solder paste with an alloy of Sn95/Ag05. We also have to double print the thickfilm pastes. I h
Electronics Forum | Thu Mar 25 13:53:28 EST 1999 | Bob Willis
| | | Your problem may be related to silver migration (leaching) into the solder. I had what seems to be a similar problem. The solution was using solder with 2% silver content. See these pages for a bit more information: | | | | http://www.ferr
