Electronics Forum | Mon Jul 24 11:35:42 EDT 2006 | Jimk@ics-inc.org
We have experienced a problem with tin leaching or discoloration of lead terminals on random parts on solder side of a paste/paste operation. The profile has been used on previous production runs and there doesn't appear to be any heat damage to othe
Electronics Forum | Tue Jun 20 19:15:19 EDT 2006 | grantp
Hi, What are your thoughts about the article saying that the lead will leach out of the solder joint to the last place to cool, creating a weak point? I have two worries about the report. First, is that we have always used tin lead solder, and le
Electronics Forum | Thu May 04 17:14:11 EDT 2000 | Boca
Solder 'follows' heat, sounds like the fab is heating up faster than the component. Or the components are solderability 'chanllenged' and the paste turns liquid, and would rather spead out on the land than wet to the component termination. Are thes
Electronics Forum | Wed Nov 02 03:35:09 EST 2005 | Slaine
I thought it was the tin content that leached the copper so presumed 100Sn would be more aggressive?
Electronics Forum | Mon Mar 30 07:41:06 EST 1998 | Earl Moon
| Hi, | We have encountered de-wetting issues with gold plated components( SMT LEDs ). | The problem comes and go and we yet to locate the root cause ( process, component or solder paste etc ). | The rest of the components on the boards are not havi
Electronics Forum | Thu Jun 29 04:07:25 EDT 2006 | slaine
Hi I manufacture a range of components with Ag,Pd,Pt terminatons. Has the solder wetted to the componet and is the termination still left on the component? I would expect the solder to remain on the pad though, if all your other devices on the pcb ar
Electronics Forum | Thu May 04 10:35:24 EDT 2000 | Sal
THE TERMINONOLY I USED SEEMS TO BE INCORRECT , I THINK THE TERM I WAS LOOKING FOR IS WICKING . BACK TO THE PROBLEM , ISSUES WITH RESNETS, WHERE THE SOLDER PASTE SEEMS TO BE WICKING AWAY FROM THE TERMINATIONS OF THE COMPONENT TOWARDS THE VIAS WHICH AR
Electronics Forum | Mon Apr 28 16:36:11 EDT 2003 | razor
Component: Termination (barrier) NI, 120/3.0 um Solder Plate (outer) 90% Sn, 10% Pb, 120/3.0 um Solder: Multicore CR39, 95.5%Sn/3.8%Ag/.7%Cu @ 6mil Flex PCB: Cu, Ni, Au .2m to .5m Thanks
Electronics Forum | Tue Nov 30 17:47:25 EST 2010 | ck_the_flip
1.) Are there any industry white papers written that document any advantages in running this alloy? From what I've read, this alloy was formulated to prevent leaching of silver for silver-bearing component terminations. 2.) Are there any concerns w
Electronics Forum | Wed Mar 24 02:23:14 EST 1999 | P.L. Sorenson - Technical Consultant
| | | Has any one seen failures of chip resistors after 1-2 years where the junction between the silver termination and the restive element on the top of the ceramic has corroded through. This results in a high resistance failure after this period of
