Electronics Forum | Wed Aug 23 16:46:52 EDT 2000 | Dr. Ning-Cheng Lee
Comparing 62Sn/36Pb/2Ag with 63Sn/37Pb, addition of 2% Ag introduces two major advantages. The first advantage is grain refining, and the resultant better fatigue resistance. The second advantage is a wider processing window on Ag metallization. Pres
Electronics Forum | Tue Aug 22 14:59:55 EDT 2000 | Mike Naddra
What does the reflow profile look like , the question I had was surrounding the higher reflow temperature and the max temperature that lowest thermal mass components will see. Some other questions that I had were surrounding the components , what of
Electronics Forum | Thu Sep 16 17:22:16 EDT 1999 | DaveJ
We have some SMT components with gold plated leads. They're actually LCC led packages. A good solder alloy to use would be Indium / Lead to reduce tin dissolution into the gold and avoid the resultant brittle intermetallic compound. However, a recomm
Electronics Forum | Tue Jun 04 16:12:41 EDT 2002 | Bob
The original profile had a higher ramp rate, and the apertures were 100%. The ramp rate is now much gentler and the addition of a small soak area around 160 � 170 degrees should burn off any excess flux. Appertures are now smaller and we get no leac
Electronics Forum | Thu Jan 15 09:40:47 EST 2004 | davef
Search the fine SMTnet Archives. For instance: http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=24429 Do not get your hopes up about finding something to support your "leaching out of silver theory", though. * AgxSn IMC are disbursed ro
Electronics Forum | Mon Mar 11 11:11:38 EST 2002 | slthomas
Tahnk you for posting the charts. > > They look > very useful, but I have a silly question: In > reflow problems _ What is "leaching" ? Dissolution of the component metallisation into the liquid solder. _ > What is "Halo effect" ? "...a
Electronics Forum | Tue Jun 15 22:31:06 EDT 2010 | Mag10
Depending on the how you plug the via, the void level can significantly affected. If you have via plugged from the bottom side; i.e. opposite side of the component, you will see alot of void due to entrapped air in the via hole. I found work best wh
Electronics Forum | Thu Sep 16 18:07:16 EDT 1999 | Earl Moon
| We have some SMT components with gold plated leads. They're actually LCC led packages. A good solder alloy to use would be Indium / Lead to reduce tin dissolution into the gold and avoid the resultant brittle intermetallic compound. However, a reco
Electronics Forum | Tue Dec 16 15:43:26 EST 2008 | fctassembly
Converting your machine from lead to lead-free can be performed in a few steps: 1)Ensure the solder bath is up to temperature 2)De-dross the solder bath 3)Remove pumps/ flow ducts; etc. clean very well- set aside 4)Purge leaded solder 5)Remove as muc
Electronics Forum | Fri May 07 00:52:24 EDT 2010 | boardhouse
Hi Derek, just curious of one thing - are the vias within the BGA's the only vias covered or are all vias on the board covered. Just trying to figure out what is making this area different from the rest of the board. Regarding leaching, I do not be
