Electronics Forum | Tue Dec 16 15:43:26 EST 2008 | fctassembly
Converting your machine from lead to lead-free can be performed in a few steps: 1)Ensure the solder bath is up to temperature 2)De-dross the solder bath 3)Remove pumps/ flow ducts; etc. clean very well- set aside 4)Purge leaded solder 5)Remove as muc
Electronics Forum | Fri May 07 00:52:24 EDT 2010 | boardhouse
Hi Derek, just curious of one thing - are the vias within the BGA's the only vias covered or are all vias on the board covered. Just trying to figure out what is making this area different from the rest of the board. Regarding leaching, I do not be
Electronics Forum | Tue May 30 08:46:10 EDT 2006 | patrickbruneel
Interesting read, I guess they finally figured it out (with 32 days left) 2 quotes from the articles "What is surprising however � although it should not be � is that, despite the claims of health and environmental threats, the latter based on the r
Electronics Forum | Wed Sep 07 04:28:26 EDT 2005 | Slaine
were looking at paste, wire, preforms and solder bars (for solder pots), concentraiting on HMP, sn62,96S, and 2 different sac alloys, we also have 7 different fluxes and 16 temination inks (which were also having to change for RoHS because the ink co
Electronics Forum | Tue Jul 04 16:13:09 EDT 2000 | TOOLMANTIM
HELLO BILL I HAVE SOME QUESTIONS FOR YOU 1:HOW ARE YOU CLEANING YOUR STENCIL 2:ARE YOU SINGLE OR DOUBLE PRINTING. 3:ARE YOU USEING VACUUM FIXTURES OR NOT? HERE ARE SOME OTHER THINGS TO TRY. IF YOU ARE CLEANING YOUR STENCIL OFTEN BECAREFUL OF USEING
Electronics Forum | Thu May 25 03:31:17 EDT 2006 | slaine
Hi I manufacture ceramic parts that have a terminations that are palladium/platinum/silver or any combination of the 3. Termination Ink usually consists of 3 main parts the alloy, glass frit and binder. Binder is to help bind everything together whi
Electronics Forum | Thu May 06 13:06:36 EDT 2010 | dwonch
Unfortunately nothing ground breaking to report. The board shops analysis (SEM/EDS)showed high levels of carbon and oxygen, likely indicating an organic based contaminate. They are still stumped on where it is coming from. We recieved some boards y
Electronics Forum | Fri May 07 09:25:55 EDT 2010 | dwonch
Yes, the vias under the BGAs are the only ones capped. I tend to agree with you that the leaching should affect the bottom more than the top and that was actually the case with the two previous shops that had this problem. We suspected with those s
Electronics Forum | Thu Sep 16 20:55:35 EDT 1999 | Dave F
| | We have some SMT components with gold plated leads. They're actually LCC led packages. A good solder alloy to use would be Indium / Lead to reduce tin dissolution into the gold and avoid the resultant brittle intermetallic compound. However, a re
Electronics Forum | Tue Aug 07 19:32:40 EDT 2007 | davef
Zinc from the brass diffuses into the solder and reacts with tin causing dezincification. Dezincification is a specific type of de-alloying, or selective, leaching corrosion of brass fittings. This type of corrosion selectively removes zinc from th
