Full Site - : solder mask bubbling (Page 10 of 249)

IPC RELEASES NEW REVISION OF SURFACE MOUNT DESIGN AND LAND PATTERN STANDARD

Industry News | 2010-07-22 22:37:02.0

IPC — Association Connecting Electronics Industries® has released the B revision of IPC-7351, Generic Requirements for Surface Mount Design and Land Pattern Standard. The leading industry standard for surface mount land pattern design and layout, IPC-7351B provides designers and printed board fabricators with updated guidance on requirements of land pattern geometries used for the surface attachment of electronic components, as well as surface mount design recommendations for achieving the best possible solder joints.

Association Connecting Electronics Industries (IPC)

Updates to IPC-6012 and IPC-A-600 Released: Five Years of New Board Technologies and Processes Bring Significant Changes to Specifications.

Industry News | 2010-04-10 02:09:54.0

If a picture is worth a thousand words, the new H revision of IPC-A-600, Acceptability of Printed Boards, is a priceless work of art for fabricators and assemblers, particularly inspectors and product developers. IPC — Association Connecting Electronics Industries® announces the new releases of IPC-A-600H and its companion document the C revision of IPC-6012, Qualification and Performance Specification for Rigid Printed Boards.

Association Connecting Electronics Industries (IPC)

Electronics Industry Volunteers Honored for Contributions to Industry and IPC

Industry News | 2011-04-20 21:26:17.0

IPC — Association Connecting Electronics Industries® presented Special Recognition, Distinguished Committee Leadership and Committee Service awards and a Presidents Award at IPC APEX EXPO™, held April 10–14, in Las Vegas.

Association Connecting Electronics Industries (IPC)

New BGA Solder Mask Repair Technique Using Laser Cut Stencils

Technical Library | 2007-02-01 10:08:40.0

The increased replacement of high lead count SMT devices with BGAs and other high ball count area array packages has brought increased challenges to PCB rework and repair. Often solder mask areas surrounding BGA pad areas are damaged when components are removed.

BEST Inc.

Laser Part Marking and Demarking  for Electronics

Laser Part Marking and Demarking for Electronics

Videos

BEST provides laser machining services for : part marking and demarking, slective solder mask removal, selective coating removal, flex circuit fabrication and precision cable selective stripping. More on using a laser to mark and demark electronic c

BEST Inc.

StencilQuik™ BGA Rework Stencils

StencilQuik™ BGA Rework Stencils

New Equipment | Solder Paste Stencils

Eliminate hours of solder mask damage repair time for bga sites while improving rework yield. Are you frustrated by the time it takes to repair mask damage underneath the BGA during the rework process?  Are you squeezed for space on the PCB in an

BEST Inc.

Bare Board Rework/ECO Services

Bare Board Rework/ECO Services

New Equipment | Rework & Repair Services

BEST is your source for PCB rework of printed circuit boards. The following services are available to you for performing ECOs on bare printed circuit baords: Pad adds Trace adds Trace cuts Solder mask ablation to rezise pad area Remarking of PCB

BEST Inc.

PCB Epoxy Repair Kit

PCB Epoxy Repair Kit

New Equipment | Rework & Repair Equipment

The BEST PCB Epoxy Repair Kit can be used to repair lifted pads and traces as well as build up and repair edge corner damage to PCBs or repair solder mask which has been damaged or removed. By adding colorants a pcb color epoxy kit can be made up cus

BEST Inc.

PCB Rework & Repair Services - BEST, INC.

PCB Rework & Repair Services - BEST, INC.

Videos

This video presents the capabilities of BEST Inc in terms of its ability to perform high end PCB rework and repair services. BEST Inc., located in Rolling Meadows IL is a company of soldering "geeks". We rework/repair PCBs, train and certify solderin

BEST Inc.

BGA Reballing Services

BGA Reballing Services

New Equipment | Rework & Repair Services

BGA Reballing Services BEST provides BGA reballing services for your plastic-, ceramic- and metalbodied components down to 0.3mm pitch. We have the ability to develop the BGA reballing process you want with a variety of deballing methods and machine

BEST Inc.


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