Industry News | 2018-10-18 09:21:56.0
RECENT SELECTIVE SOLDERING INDUSTRY TRENDS
Industry News | 2018-10-18 08:29:16.0
How to Prevent Short Circuits to Ground in QFN Components?
Industry News | 2018-10-18 09:06:41.0
Gold Fingers: A Guide to Understanding Gold-Plated PCB Connectors
Industry News | 2018-10-18 09:52:32.0
Printed Circuit Board (PCB) Price Estimator
Industry News | 2018-10-18 11:06:26.0
Halogen-free / Lead-free Printed Circuit Boards
Industry News | 2012-11-07 11:01:55.0
IPC and SMTA jointly announce the agenda for Session 6 of the High-Reliability Cleaning and Coating Conference, scheduled to take place November 13-15, 2012 at the Crowne Plaza Hotel – O’Hare in Chicago, IL.
Industry News | 2018-08-16 19:58:50.0
The SMTA Capital Chapter is holding its upcoming Capital Expo and Tech Forum at Johns Hopkins University / Applied Physics Lab, Kossiakoff Center, 11100 Johns Hopkins Road, Laurel, MD 20723, on Thursday, August 23rd.
Industry News | 2014-04-11 09:06:53.0
Renee Michalkiewicz, MIT, general manager, Trace Laboratories, Baltimore, has been elected chair of the IPC Technical Activities Executive Committee (TAEC) for a two-year term.
Industry News | 2015-09-30 10:08:42.0
IPC — Association Connecting Electronics Industries® has released IPC-6012D, Qualification and Performance Specification for Rigid Printed Boards. IPC delivers the most current specifications for rigid printed board requirements to the electronic industry. The newly updated revision D will be release in conjunction with IPC-6012DS, Space and Military Avionics Applications Addendum to IPC-6012D, Qualification and Performance Specification for Rigid Printed Boards, which addresses requirements for space and military avionics.
Industry News | 2019-04-14 18:51:44.0
IPC -- Association Connecting Electronics Industries® invites engineers, researchers, academics, technical experts and industry leaders to submit presentation topics and descriptions for IPC Electronics Materials Forum, a new technical conference focusing on developments in materials and processes associated with electronics assembly and manufacturing. The conference will be held in Minneapolis, Minn., November 5-7, 2019.
