Cost effective manual stencil printer designed for low to medium volume assembly production runs. The SPR-20 benchtop, manual stencil printer is designed for low to medium volume assembly runs. Precise X,Y, Z, and theta axis controls allow for accur
Technical Library | 2013-02-07 17:01:46.0
Silicone contamination is known to have a negative impact on assembly processes such as soldering, adhesive bonding, coating, and wire bonding. In particular, silicone is known to cause de-wetting of materials from surfaces and can result in adhesive failures. There are many sources for silicone contamination with common sources being mold releases or lubricants on manufacturing tools, offgassing during cure of silicone paste adhesives, and residue from pressure sensitive tape. This effort addresses silicone contamination by quantifying adhesive effects under known silicone contaminations. The first step in this effort identified an FT-IR spectroscopic detection limit for surface silicone utilizing the area under the 1263 cm-1 (Si-CH3) absorbance peak as a function of concentration (µg/cm2). The next step was to pre-contaminate surfaces with known concentrations of silicone oil and assess the effects on surface wetting and adhesion. This information will be used to establish guidelines for silicone contamination in different manufacturing areas within Harris Corporation... First published in the 2012 IPC APEX EXPO technical conference proceedings.
New Equipment | Assembly Services
China Double Sided Circuit Boards Fabricaiton and Assembly PCBA Turnkey Manufacturer 2 Layers circuit boards PCB FR4 1.6mm PCB fabrication and assembly 1oz PCB copper thickness Shenzhen PCB and PCBA manufacturer China turnkey contract electroni
Industry News | 2012-03-09 16:13:42.0
Seika Machinery will highlight its new, innovative products at the upcoming SMTA Indiana Expo & Trade Forum.
Industry News | 2003-07-10 08:55:57.0
The PVA 750 is a programmable spray coating machine primarily designed for applying conformal coatings to printed circuits.
Industry News | 2019-05-02 00:32:32.0
Since last 2 years, material cost has been dropped 20%
Technical Library | 2016-10-20 18:13:34.0
Pad cratering failure has emerged due to the transition from traditional SnPb to SnAgCu alloys in soldering of printed circuit assemblies. Pb-free-compatible laminate materials in the printed circuit board tend to fracture under ball grid array pads when subjected to high strain mechanical loads. In this study, two Pb-free-compatible laminates were tested, plus one dicycure non-Pb-free-compatible as control. One set of these samples were as-received and another was subjected to five reflows. It is assumed that mechanical properties of different materials have an influence on the susceptibility of laminates to fracture. However, the pad cratering phenomenon occurs at the layer of resin between the exterior copper and the first glass in the weave. Bulk mechanical properties have not been a good indicator of pad crater susceptibility. In this study, mechanical characterization of hardness and Young’s modulus was carried out in the critical area where pad cratering occurs using nano-indentation at the surface and in a cross-section. The measurements show higher modulus and hardness in the Pb-free compatible laminates than in the dicy-cured laminate. Few changes are seen after reflow – which is known to have an effect -- indicating that these properties do not provide a complete prediction. Measurements of the copper pad showed significant material property changes after reflow.
Industry News | 2010-05-29 18:57:32.0
MARTIN will demonstrate the Reball/Prebump 03.1 unit at the upcoming SMTA Upper Midwest Expo, scheduled to take place Wednesday, June 9, 2010, at the Sheraton Bloomington Hotel in Bloomington, MN. This standalone unit is an easy and cost effective solution for BGA reballing and QFN solder bumping.
Industry News | 2010-06-30 12:09:49.0
MARTIN will demonstrate the Reball / Prebump 03.1 unit at the upcoming SMTA Ohio Valley Expo & Tech Forum, scheduled for Wednesday, July 14, 2010 at the Doubletree Hotel in Cleveland, OH. This standalone unit is an easy and cost effective solution for BGA reballing and QFN solder bumping.
The FINEPLACER® lambda is a flexible sub-micron bonder used for precise placement, die attach and advanced packaging. The system offers outstanding flexibility with a modular design and can be easily reconfigured for different applications. The syst
