New Equipment | Solder Materials
Liquid Photoimageable Solder Application Since the introduction of Liquid Photoimageable Solder Masks (LPSIM) in the late 1980's, SolderMask, Inc. has continued to be the premier service-bureau applying it to PCB's. SolderMask, Inc. was the first
Industry Directory | Manufacturer
PCB solder mask, PCB etching resist ink, LED white solder mask. UV curing solder mask, UV curing anti-acid etching resist ink
Polyimide masking discs have 1.2~1.5 mil of silicon adhesive which does not leave any residue. It can withstand temperature up to 280℃. Applications: Electrical Insulation, Gold leaf mask of printed circuit boards during wave soldering, transformer
The Fire Problem The Flame ProblemThe ever-increasing and widespread use of electronic devices, such as laptops, tablets, personal digital assistants (PDA’s) and smart phones is requiring longer and longer battery life. The batteries become increas
Parts & Supplies | Circuit Board Assembly Products
1). FR-4 Material 2). 2 layer, 1.2mm thick 3). 5 oz copper weight. 4). LPI Green solder mask/White silk screen 5). Immersion gold over nickle
Parts & Supplies | Circuit Board Assembly Products
1). Strip size 580*17mm 2). Aluminum base, 1.0mm, 1oz 3). Single sided layer 4). White solder mask/Black legend 5). HASL 6). LED high power
New Equipment | Solder Materials
A variety of printed circuit boards require protection of selected board areas during the Surface Finish or Assembly Process. A wide range of PEELABLE SOLDER MASKS, the SD 295X Series including the popular SD 2954 and SD 2955 provide such protection
Lite Fast SR-1000, a UV Solder Mask, was designed to screen print over conductive traces, landing pads, resistors, fuses and capacitors on Printed Circuit Boards (PCBs) and ceramic substrates. Other applications include metal and various plastics.
New Equipment | Solder Paste Stencils
SolderMask Services - Stencils and Custom Stencils Since 1994, SolderMask, Inc. has fabricated solder paste stencil using a photo-chemical etching process. In 1998, we installed our first laser to cut the apertures of the solder paste stencil. Now,
170 oC) Phenolic cured (Dicy Free) system with inorganic filler High Td (decomposition temp. > 340 oC by TGA) Lead free process compatible (260 oC IR reflow 6x + 288 oC solder flow 3x, no delamination) Low Coefficient of Thermal Expansion ( 60 min. T
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