New Equipment | Solder Materials
Soldering Flux, Paste & Wire supplies from Kester, BonKote, Circuit Works, Techspray, Start International, Chemtronics, Xuron Bar Solder Flux & Thinners Flux Pens Solder Mask Solder Paste Solder Wire
New Equipment | Solder Paste Stencils
SolderMask Services - Stencils and Custom Stencils Since 1994, SolderMask, Inc. has fabricated solder paste stencil using a photo-chemical etching process. In 1998, we installed our first laser to cut the apertures of the solder paste stencil. Now,
Lite Fast SR-1000, a UV Solder Mask, was designed to screen print over conductive traces, landing pads, resistors, fuses and capacitors on Printed Circuit Boards (PCBs) and ceramic substrates. Other applications include metal and various plastics.
Technical Library | 1999-07-21 09:04:04.0
A high volume manufacturer of printed circuit boards (PCBs) had attempted for many years to locate an adhesive that was robust enough to meet their manufacturing needs. This proved to be a challenge because they needed the adhesive to accommodate a wide range of different dispensing equipment and board designs. The two key performance criteria required from the adhesive were dispensability and adhesion...
New Equipment | Assembly Services
PCB Prototype - 2 Layer, Metal Core Board, Hard Gold Plating 30u", With Black Solder Mask - 2 layer, metal core board, hard gold plating 30u", with black solder mask. Advantages: - Metal core board. A PC board to be populated with electronic compo
Xuron - Micro-shears, cutters, pliers and solder mask.
sales5_at_etlimited_cn Halogen free PCB,PCB boards, PCB prototype, pcb solder mask,FREE PCB Key speciafications/special features: 8 layers PCB Base material: Ceramics, Aluminum, Rogers, high Tg, F4B, F4B
Industry Directory | Distributor / Manufacturer's Representative
Manufacturer's representative/distributor of equipment and consumables used in the PCB assembly industry. We specialize in soldering and cleaning equipment and also tape splicing products including cover tape extenders and tools.
Used SMT Equipment | Soldering - Wave
Options: (1) IR-preheating, bottom side segmented pin/chain and roller conveyor for versaflow with double soldering module programmable conveyor width adjust (4) convection preheating top side automatic solder wire feeder, solder
Technical Library | 2021-11-03 16:49:59.0
Ultrathin bare die chips were soldered using a novel soldering technology. Using homogeneous flash light generated by high-power xenon flash lamp the dummy components and the bare die NFC chips were successfully soldered to copper tracks on polyimide (PI) and polyethylene terephthalate (PET) flex foils by using industry standard Sn-Ag-Cu lead free alloys. Due to the selectivity of light absorption, a limited temperature increase was observed in the PET substrates while the chip and copper tracks were rapidly heated to a temperatures above the solder melting temperature. This allowed to successfully soldered components onto the delicate polyethylene foil substrates using lead-free alloys with liquidus temperatures above 200 °C. It was shown that by preheating components above the decomposition temperature of solder paste flux with a set of short low intensity pulses the processing window could be significantly extended compared to the process with direct illumination of chips with high intensity flash pulse. Furthermore, it was demonstrated that with localized tuning of pulse intensity components having different heat capacity could be simultaneously soldered using a single flash pulse.