Industry Directory | Distributor / Manufacturer / Manufacturer's Representative / Standards Setting / Certification / Training Provider
PB Technik supplies SMT equipment and materials to the Polish market. JUKI ERSA EKRA BRADY MARANTZ
New Equipment | Solder Materials
A variety of printed circuit boards require protection of selected board areas during the Surface Finish or Assembly Process. A wide range of PEELABLE SOLDER MASKS, the SD 295X Series including the popular SD 2954 and SD 2955 provide such protection
Electronics Forum | Wed Aug 17 13:57:27 EDT 2005 | ppwlee
We have encountered what appears to be mask discoloration after wave soldering. The areas of concern coincide with the areas that were exposed selectively by fixtures during wave soldering, dominated by one date code of PCB with a slightly different
Electronics Forum | Thu Nov 19 08:20:04 EST 1998 | Earl Moon
| | | | For some as yet unkown reason, we have started to have some boards sag and go under the wave. The boards are surface mount top side and conventional components wave soldered. We have checked the wave hight and both the profiles on the wave so
Industry News | 2017-02-03 13:13:40.0
Market Leader AdoptSMT will showcase at Southern Manufacturing an array of new innovative products. These products and the service AdoptSMT offers their customers make AdoptSMT’s slogan become true: We keep your production running. AdoptSMT covers the processes of PCB assembly, hand soldering and industrial identification.
Industry News | 2017-03-08 16:04:03.0
Market Leader AdoptSMT will showcase at Amper Brno an array of new innovative products. These products and the service AdoptSMT offers their customers make AdoptSMT’s slogan become true: We keep your production running. AdoptSMT covers the processes of PCB assembly, hand soldering and industrial identification.
GPD Global | https://www.gpd-global.com/co_website/pcdpumpseries-optimizeddisppath-max.php
& Fill / Glob Top Encapsulation Hot Melt LED Encapsulation Solder Mask Solder Paste Surface Mount Adhesive Thermal Interface Material Trench Filling Underfill UV Curing Wafer Processing OTHER
Surface Mount Technology Association (SMTA) | https://www.smta.org/education/presentations/presentations.cfm
occurrence and the failure mode itself i.e. increase of leakage currents, electrochemical migration and corrosion. The parameters such as solder mask, residues from PCBA assembly process, and PCBA layout and components have an influence on the water layer
