Technical Library | 2023-11-27 18:29:45.0
This paper examines the modeling of viscoplastic solder behavior in the vicinity of interfacial cracking for flip chip semiconductor packages. Of particular interest is the relationship between viscoplastic deformation in the solder bumps and any possible interface cracking between the epoxy underfill layer and the silicon die. A 3-D finite element code, developed specifically for the study of interfacial fracture problems, was modified to study how viscoplastic solder material properties would affect fracture parameters such as strain energy release rate and phase angle for nearby interfacial cracks. Simplified two-layer periodic symmetry models were developed to investigate these interactions. Comparison of flip chip results using different solder material models showed that viscoplastic models yielded lower stress and fracture parameters than time independent elastic-plastic simulations. It was also found that adding second level attachment greatly increases the magnitude of the solder strain and fracture parameters. As expected, the viscoplastic and temperature dependent elastic-plastic results exhibited greater similarity to each other than results based solely on linear elastic properties. !DOI: 10.1115/1.1649242"
Technical Library | 2021-11-03 17:05:39.0
Additively printed circuits provide advantages in reduced waste, rapid prototyping, and versatile flexible substrate choices relative to conventional circuit printing. Copper (Cu) based inks along with intense pulsed light (IPL) sintering can be used in additive circuit printing. However, IPL sintered Cu typically suffer from poor solderability due to high roughness and porosity. To address this, hybrid Cu ink which consists of Cu precursor/nanoparticle was formulated to seed Cu species and fill voids in the sintered structure. Nickel (Ni) electroplating was utilized to further improve surface solderability. Simulations were performed at various electroplating conditions and Cu cathode surface roughness using the multi-physics finite element method. By utilizing a mask during IPL sintering, conductivity was induced in exposed regions; this was utilized to achieve selective Ni-electroplating. Surface morphology and cross section analysis of the electrodes were observed through scanning electron microscopy and a 3D optical profilometer. Energy dispersive X-ray spectroscopy analysis was conducted to investigate changes in surface compositions. ASTM D3359 adhesion testing was performed to examine the adhesion between the electrode and substrate. Solder-electrode shear tests were investigated with a tensile tester to observe the shear strength between solder and electrodes. By utilizing Cu precursors and novel multifaceted approach of IPL sintering, a robust and solderable Ni electroplated conductive Cu printed electrode was achieved.
Industry News | 2014-08-28 15:48:58.0
Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN), announces that Dr. Evstatin Krastev, Director of Applications, will present two papers at the upcoming SMTA International exhibition.
Industry News | 2015-12-10 01:13:20.0
We are very pleased to help organise the NPL monthly webinars which are free to join and provide support to the industry world wide
Industry News | 2016-01-08 11:10:28.0
NPL Electronics Interconnection Group Webinars 2016 Launched We are very pleased to help organise the NPL monthly webinars which are free to join and provide support to the industry world wide on a wide range of manufacturing subjects
Industry News | 2018-11-27 13:54:13.0
Super PCB, a single source for high-quality printed circuit boards (PCBs), is pleased to offer aluminum and FR4 PCBs for LED lighting. The company can produce both prototypes and mass production for LED lighting applications.
Industry News | 2010-03-30 15:51:22.0
HONG KONG - WKK Distribution Ltd., the leading supplier of industrial machinery and materials in Asia, announces that Lionel Fullwood, Technical Director, will present a paper titled "A New System for Automatically Registering and Exposing Solder Mask and Other Photopolymeric Materials Requiring High Energy Lamp Sources" at the upcoming IPC/APEX conference and exhibition,
Industry News | 2019-01-17 17:06:16.0
Hover-Davis, the global leader in the design and manufacture of electronic component and media delivery solutions, will celebrate its 30 year anniversary at IPC APEX Expo in San Diego, CA on January 29-31 where it will display its latest feeder and material automation solutions.
Industry News | 2016-07-10 14:03:14.0
Eunil has released its latest in-line coating machine, the ECM-1100, as part of the Coating Master ECM Series.
Industry News | 2023-11-13 12:17:36.0
Advanced, digital alternative to silk-screen expands one-stop-shop for electronic manufacturing
