Industry Directory | Manufacturer
The exclusive supplier of SIPAD Solid Solder Deposit in North America and the only SIPAD Solid Solder Deposit (SSD) coating service bureau in the world.
Used SMT Equipment | Adhesive Dispensers
Camelot 1818 Glue Dispenser $3,700.00 1993 vintage -Primo Condition! Refurbished by Speedline in 2000 and only used it a few times after that! Solder Paste Syringe Downward Looking Fiducial Camera-Manual Adjust Tactile Sensor- Probe for measurin
Industry News | 2016-09-21 15:44:21.0
From booth #936 at the upcoming SMTA International event in Rosemont, Illinois, Henkel Adhesive Electronics’ display will underscore why the company leads the market in comprehensive assembly materials technologies. With multi-award-winning LOCTITE GC solder materials, a broad range of leading-edge thermal management technologies, and new applications for TECHNOMELT products, the Henkel booth is the go-to destination for advanced electronics assembly materials.
Industry News | 2022-10-11 17:13:35.0
ZESTRON is pleased to announce that it will host a webinar titled "Solder Mask and Low Stand-off Component Cleaning" on Tuesday, October 18th, from 11:00 AM to 12:00 PM EDT. This is the eighth installment of the ZESTRON Academy 2022 Cleaning Webinar Series and will be presented by our industry expert, Jigar Patel, Senior Application Engineer.
Industry News | 2022-10-20 07:00:57.0
ZESTRON is pleased to announce that it will host a webinar titled "Solder Mask and Low Stand-off Component Cleaning" on Tuesday, October 18th, from 11:00 AM to 12:00 PM EDT. This is the eighth installment of the ZESTRON Academy 2022 Cleaning Webinar Series and will be presented by our industry expert, Jigar Patel, Senior Application Engineer.
Technical Library | 2015-12-31 15:19:28.0
Today's consumer electronic product are characterized by miniatuization, portability and light weight with high performance, especially for 3G mobile products. In the future more fine pitch CSPs (0.4mm) component will be required. However, the product reliability has been a big challenge with the fine pitch CSP. Firstly, the fine pitch CSPs are with smaller solder balls of 0.25mm diameter or even smaller. The small solder ball and pad size do weaken the solder connection and the adhesion of the pad and substrate, thus the pad will peel off easily from the PCB substrate. In addition, miniature solder joint reduce the strength during mechanical vibration, thermal shock, fatigue failure, etc. Secondly, applying sufficient solder paste evenly on the small pad of the CSP is difficult because stencil opening is only 0.25mm or less. This issue can be solved using the high end type of stencil such as Electroforming which will increase the cost.
Industry News | 2015-01-08 14:04:52.0
At Southern Manufacturing 2014 AdoptSMT UK Ltd., member of AdoptSMT Group, will again present many new products for the European PCB Assembly Industry. The supplies, services and consultancy offered by AdoptSMT Group are focused around the aim to keep the customers production running. The main process supported by AdoptSMT with consumables, spares, service and pre-owned equipment is the automatic PCB Assembly including stencil printing, reflow soldering and AOI.
Demonstration of BGA rework via stencil printing. BEST's StikNPeel stencil is an adhesive backed stencil which allows users to stick the stencil in to place and simply peel it off the PCB with a temporary adhesive system. This leaves consistent print
Industry News | 2013-03-27 15:19:20.0
Showcasing its products at SMT 2013 trade fair in Nuremberg, AdoptSMT Europe will continue to focus on its fast growing second core segment of spare parts, tools and consumables offering its customers new products and innovative solutions.
Industry News | 2016-03-27 14:19:07.0
Henkel Adhesive Technologies’ award-winning Technomelt® materials have long been recognized as the industry standard for high-performance low pressure molding applications. Extending the effectiveness of the portfolio outside of proven encapsulation processes, a newly-formulated Technomelt is now also providing a streamlined and economical alternative to conventional masking techniques for various coating requirements.
