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Bicheng Bicheng via in pad PCB

Bicheng Bicheng via in pad PCB

Parts & Supplies | Circuit Board Assembly Products

1). 80 *190mm/2up, FR-4 2). 6 layers at 1.4mm thick 3). 35 μm copper weight 4). Green solder mask LPI/White legend 5). ENIG surface finish 6). Blind via from Layer 1 to layer 2 7). Via in pad plugged conductive resin

Bicheng Enterprise Company

Dry Film Solder Mask

Dry Film Solder Mask

New Equipment | Solder Paste Stencils

Dry Film Solder Application SolderMask, Inc. continues to apply Dry Film Solder Mask (DFSM) on Printed Circuit Boards (PCB) since opening for business in 1985. SolderMask, Inc. works with all DFSM available in the United States. Some of the DFSM ma

SolderMask Inc.

BICHENG Double sided PCB

BICHENG Double sided PCB

Parts & Supplies | Circuit Board Assembly Products

1) 190*130mm/10up, FR-4, Tg 135, CTI 175-225V 2) Dielectric constant(Er): 4.4-5.2 3) 2 layers, 1.6mm thick, 1 oz 4) Min. hole size: 0.3mm 5) Min. track/space: 4/4 mils 6) LPI Solder mask/White legend 7) Fiducial mark, tooling strips, mounting holes

Bicheng Enterprise Company

Bicheng Bergquist T-Clad MCPCB

Bicheng Bergquist T-Clad MCPCB

Parts & Supplies | Circuit Board Assembly Products

1). 80*50mm/1up, Bergquist Thermal Clad aluminium backed 2). LTI-04503,MP-06503,ML-11006 3). Ceramic dielectric material, conductivity: 1.3W/m-k, 2.2W/m-k, 4). 1.6mm thick, single sided, 35μm (1 oz) 5). Black solder mask/no ident 6). CNC rout outli

Bicheng Enterprise Company

Bicheng CSP printed circuits

Bicheng CSP printed circuits

Parts & Supplies | Circuit Board Assembly Products

1). 100mm x 98mm/1up, FR-4, 2). 1mm +/-0.1mm,6 Layers 3). 1oz copper finished 3). Green solder mask/white legend 4). Min. hole 0.15mm, 4/4 mil track/gap 5). Blind via layer 1-2, via-in-pad. 6). Immersion gold surface finish

Bicheng Enterprise Company

Bicheng XPC/ FR-1 Single sided PCB

Bicheng XPC/ FR-1 Single sided PCB

Parts & Supplies | Circuit Board Assembly Products

1) Single Sided PCB 2) Material: XPC (94HB), FR-1 (94V0) 3) Thickness: 1.0mm, 1.2mm, 1.6mm 4) Copper weight: 0.5 oz, 1 oz 5) UV solder mask 6) Profile: Punch/ rout 7) Surface finish: OSP, Electro Gold

Bicheng Enterprise Company

BICHENG HDI Printed circuits

BICHENG HDI Printed circuits

Parts & Supplies | Circuit Board Assembly Products

1). 1+C+1 HDI, buried/blind L1-L5/L5-L8 vias. 2). FR-4 Material, 1 oz weight. 3). 8 layer, 1.6mm thick. 4). 4/4 mils track and space 5). Min.drill 0.1mm 6). Green solder mask/ white silkscreen 7). Immersion gold over nickel

Bicheng Enterprise Company

BICHENG Fine-pitch BGA PCB

BICHENG Fine-pitch BGA PCB

Parts & Supplies | Circuit Board Assembly Products

1). 177 x 75mm (2UP), FR-4 Tg 170 2). 1.6mm +/-10%, 6 layer 3). Min. hole 0.15mm, 4/4 track/gap 4). Finished copper weight inner/outer 1 oz 5). Green solder mask/ White ident 6). Immerstion gold. 7). Fine and micro BGA

Bicheng Enterprise Company

1stMaskingtape

Industry Directory |

Source for Masking Tapes to Electronic Industry. Products are Kapton Masking tape, Solder wave tape, Masking Disc

Solder Mask Removal

Solder Mask Removal

New Equipment | Rework & Repair Equipment

MLT provides laser services for selective solder mask removal as a precise and controlled rework option.  No more scrapping or tedius hours to rework selective areas to recover simply unwanted solder mask.  This same process works from many other mat

Micron Laser Technology


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