0.3 mm nickel silver soldering emi rf shielding can for PCB board Specilized in emi rf shielding cover frame ISO 9001 2015 factory in shenzhen China
0.2mm nickel silver copper rf PCB shielding can conductive soldering material China ISO manufactuer Any RFQ please send mail to us any time
New Equipment | Fabrication Services
Gold Finger PCB No of layer: 6 layer Material: FR-4, TG170 Thickness: 1.6mm Copper thickness: 35um copper/1oz Yellow Solder Mask Surface finishing: ENIG, gold 0.05-0.1um, Nickel 3-5um Special technology: gold finger/Edge connector plating, go
Industry News | 2019-08-17 11:50:22.0
OSAKA, JAPAN — August 2019 — Nihon Superior Co. Ltd., an advanced joining material supplier, today announced plans to exhibit in Booth #1G08 at the NEPCON ASIA (NEPCON SOUTH CHINA) Show, scheduled to take place Aug, 28-30, 2019 at the Shenzhen Convention & Exhibition Center in China. The company will celebrate the achievements produced by the well-known SN100C® lead-free alloy. TipSave N flux-cored solder wire will be introduced and SN100CVTM P608 D4 solder paste will be shown.
Parts & Supplies | Circuit Board Assembly Products
1). 1+C+1 HDI, buried/blind L1-L5/L5-L8 vias. 2). FR-4 Material, 1 oz weight. 3). 8 layer, 1.6mm thick. 4). 4/4 mils track and space 5). Min.drill 0.1mm 6). Green solder mask/ white silkscreen 7). Immersion gold over nickel
Industry Directory | Manufacturer
Integran's hard nickel blanks for SMT solder stencils can be laser cut into the highest performance solder stencils on the market. Quality is underpinned by Integran's strong analytical capabilities.
Industry Directory | Manufacturer
Integran makes nanocrystalline nickel SMT solder stencil blanks that are subsequently laser cut into the high durability and very precise stencils. We make 500-1000 a month of 22.5" x 24" foils.
New Equipment | Solder Materials
WS730 is a water-based, high activity liquid flux designed to offer low-spattering and excellent wetting, even to difficult-to-solder parts. WS730 is formulated for a variety of electronic, electrical and industrial applications, including wire, cabl
Industry Directory | Consultant / Service Provider / Manufacturer / Other
MET is ready to meet your stencil requirements. We manufacture Electroformed Stencils, Laser Cut Stencils and Chemically Etched Stencils for various solder paste and glue printing applications.
Technical Library | 1999-05-07 11:28:39.0
There are many things that can go wrong when soldering to gold plate over nickel surfaces. First of all, we know that gold and solder are not good friends, as any time solder comes into contact with gold, something seems to go wrong. Either the solder bonds to the gold and eventually pulls off as the tin and gold cross-migrate, leaving voids; or the solder completely removes the gold and is expected to bond to the metal which was under the gold.
