Technical Library | 2021-09-08 13:57:37.0
While the presence of silver in SAC solder provided excellent temperature cycling durability, the silver in high silver SAC alloy also made the solders susceptible to failures under drop/shock loading. To improve the drop/shock reliability, the silver content in SAC alloys was reduced from three percent, to as low as no silver. Solder dopants, also known as microalloy additions, are elements (typically 0.1% or lower) other than the main constituents of the alloy that have been shown to improve solder performance. Commonly used microalloy additions include nickel (Ni), bismuth (Bi), manganese (Mn), and antimony (Sb).
This is video shows how to print a PCB using a prototype foil only stencil. The SMT prototype stencil (www.soldertools.net) is made from a high nickel content material able to offer repeatable high precision apertures. The steps of alignment, printin
Events Calendar | Wed Mar 18 00:00:00 EDT 2020 - Wed Mar 18 00:00:00 EDT 2020 | College Park, Maryland USA
CALCE Reliability Science Symposium - Spring 2020
Used SMT Equipment | Soldering - Reflow
Intelligent hot air lead-free reflow Oven with six heating-zones TN360C Instruction: 1: Heating system: TN360C adopts high effective nickel-chromium heating tube with advanced technology and Long life service. The hot-air circle system wh
Industry News | 2011-11-20 13:48:27.0
The Balver Zinn Group and Cobar Europe BV announces that it has been awarded a Global Technology Award in the Flux Materials category for its SCAN-Ge071-XF3+ solder paste.
Technical Library | 2020-08-05 18:49:32.0
The evolution of internet-enabled mobile devices has driven innovation in the manufacturing and design of technology capable of high-frequency electronic signal transfer. Among the primary factors affecting the integrity of high-frequency signals is the surface finish applied on PCB copper pads – a need commonly met through the electroless nickel immersion gold process, ENIG. However, there are well-documented limitations of ENIG due to the presence of nickel, the properties of which result in an overall reduced performance in high-frequency data transfer rate for ENIG-applied electronics, compared to bare copper. An innovation over traditional ENIG is a nickel-less approach involving a special nano-engineered barrier designed to coat copper contacts, finished with an outermost gold layer. In this paper, assemblies involving this nickel-less novel surface finish have been subjected to extended thermal exposure, then intermetallics analyses, contact/sheet resistance comparison after every reflow cycle (up to 6 reflow cycles) to assess the prevention of copper atoms diffusion into gold layer, solder ball pull and shear tests to evaluate the aging and long-term reliability of solder joints, and insertion loss testing to gauge whether this surface finish can be used for high-frequency, high density interconnect (HDI) applications.
Technical Library | 2016-07-07 15:37:18.0
How susceptible are the metals used in modern electronics manufacturing to corrosion by common beverages? This is a question of interest, especially to manufacturers, retailers and to a certain extent end customers. In this study the dissolution of aluminum, copper, gold, iron, lead, nickel, SAC305 solder, silver, tin and zinc was examined. Individual foils of these materials were fully immersed in one of sixteen chosen beverages and heated for 3 days at 40°C. The resulting solutions were analyzed using ICP-OES. The data were examined in light of the known pH, conductivity and ionic contents of the beverages, determined in previous work. Conclusions about the relative susceptibility to corrosion of the various metals and the corrosive power of the different beverages are made.
Industry News | 2012-01-03 10:40:18.0
Technic has announced the release of Technic EN AT5600, an electroless nickel developed specifically to eliminate black pad and to improve soldering on ENIG coated PCBs. Technic EN AT 5600 is the first electroless nickel that provides lateral growth on copper, yielding a flatter surface with less pronounced grain boundaries instead of the typical nodular, "cauliflower-like" structure from older formulas.
New Equipment | Solder Materials
KappRad has been developed specifically to join and repair Aluminum and Aluminum Copper radiators and heat exchangers. A lower melting point makes delicate repair work easier. Matching KAPP Golden Flux acts as a temperature guide to ensure simple app
Industry News | 2011-08-19 05:08:40.0
Nickel gold is one of the most popular surface finishes used in the PCB assembly industry with many advantages but also process and reliability issues.
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