Technical Library | 2014-06-23 14:50:52.0
It was unusual to see chip terminations change colors when tin lead solders were used but with the introduction of lead free reflow soldering and the corresponding increases in reflow temperatures terminations are now changing colors. Two conditions are present when reflow temperatures are increased for lead free solder alloys that leads to discoloration. Reflow temperatures are above the melting point of tin (Sn MP is 232oC). Air temperatures commonly used in forced convection reflow systems are high enough to both melt the tin plating on the termination allowing it to be pulled into the solder joint due to solder joint liquid solder surface tension leaving behind the exposed nickel barrier. Now those metal oxide colors will be visible due to high air temperatures during reflow.
Technical Library | 2021-09-08 13:57:37.0
While the presence of silver in SAC solder provided excellent temperature cycling durability, the silver in high silver SAC alloy also made the solders susceptible to failures under drop/shock loading. To improve the drop/shock reliability, the silver content in SAC alloys was reduced from three percent, to as low as no silver. Solder dopants, also known as microalloy additions, are elements (typically 0.1% or lower) other than the main constituents of the alloy that have been shown to improve solder performance. Commonly used microalloy additions include nickel (Ni), bismuth (Bi), manganese (Mn), and antimony (Sb).
Used SMT Equipment | Soldering - Reflow
Intelligent hot air lead-free reflow Oven with six heating-zones TN360C Instruction: 1: Heating system: TN360C adopts high effective nickel-chromium heating tube with advanced technology and Long life service. The hot-air circle system wh
Fine Line Stencil's unique Slic Blade™ process uses electroformed nickel to form a hard, very smooth surface with extremely low surface energy (high lubricity). Solder paste readily sticks to most metal surfaces, even coated blades, due to metal's hi
This is video shows how to print a PCB using a prototype foil only stencil. The SMT prototype stencil (www.soldertools.net) is made from a high nickel content material able to offer repeatable high precision apertures. The steps of alignment, printin
Industry News | 2012-01-26 22:34:41.0
Christopher Associates announces that Jasbir Bath, Consulting Engineer with Christopher Associates/Koki Solder, will present at the IPC APEX EXPO 2012. The presentation, “Low Temperature Tin-Bismuth and Tin-Bismuth-Silver Lead-free Solder Pastes for Electronics Manufacturing,” will take place during Session S16, titled “Lead-free Alloys,”.
Events Calendar | Wed Mar 18 00:00:00 EDT 2020 - Wed Mar 18 00:00:00 EDT 2020 | College Park, Maryland USA
CALCE Reliability Science Symposium - Spring 2020
Technical Library | 2020-08-05 18:49:32.0
The evolution of internet-enabled mobile devices has driven innovation in the manufacturing and design of technology capable of high-frequency electronic signal transfer. Among the primary factors affecting the integrity of high-frequency signals is the surface finish applied on PCB copper pads – a need commonly met through the electroless nickel immersion gold process, ENIG. However, there are well-documented limitations of ENIG due to the presence of nickel, the properties of which result in an overall reduced performance in high-frequency data transfer rate for ENIG-applied electronics, compared to bare copper. An innovation over traditional ENIG is a nickel-less approach involving a special nano-engineered barrier designed to coat copper contacts, finished with an outermost gold layer. In this paper, assemblies involving this nickel-less novel surface finish have been subjected to extended thermal exposure, then intermetallics analyses, contact/sheet resistance comparison after every reflow cycle (up to 6 reflow cycles) to assess the prevention of copper atoms diffusion into gold layer, solder ball pull and shear tests to evaluate the aging and long-term reliability of solder joints, and insertion loss testing to gauge whether this surface finish can be used for high-frequency, high density interconnect (HDI) applications.
Technical Library | 2016-07-07 15:37:18.0
How susceptible are the metals used in modern electronics manufacturing to corrosion by common beverages? This is a question of interest, especially to manufacturers, retailers and to a certain extent end customers. In this study the dissolution of aluminum, copper, gold, iron, lead, nickel, SAC305 solder, silver, tin and zinc was examined. Individual foils of these materials were fully immersed in one of sixteen chosen beverages and heated for 3 days at 40°C. The resulting solutions were analyzed using ICP-OES. The data were examined in light of the known pH, conductivity and ionic contents of the beverages, determined in previous work. Conclusions about the relative susceptibility to corrosion of the various metals and the corrosive power of the different beverages are made.
New Equipment | Solder Materials
Tip tinner to aid in cleaning and re-tinning solder iron tips de-wetted by use which can’t be repaired with sponge pads and cored solder wire. Use of TTC100C LEAD FREE Tip Tinner offers the following advantages: Lead Free SN100C tin/copper/nic
.gif)
