Electronics Forum | Tue Nov 27 07:36:29 EST 2007 | shy
solder the part is for SMT component (located at top side and bottom side) and wave solder is for THP (located at top side only).
Electronics Forum | Tue Nov 27 06:11:42 EST 2007 | shy
Hi Loco, my PCBA got top side and bottom side and 90% SMT and 10% THP (top side) which need to be cover by wave solder. And that's why i need to go through reflow and wave.
Electronics Forum | Mon Feb 12 10:02:18 EST 2007 | rgduval
A little late to the party here, sorry... Has the joint been verified as a cold solder joint? That is, visually confirmed that it looks like cold solder, and, perhaps, xrayed to confirm the solder status? X-raying may sound a bit extreme, but you'
Electronics Forum | Thu Nov 29 22:31:27 EST 2007 | shy
Hi Stephen, The component falling off is the component that had glue. the component witout glue is being covered by masking during wave. What is the meaning by populated the part and cure it? is it run with solder paste profile or glue profile or yo
Electronics Forum | Mon Sep 21 20:45:55 EDT 2009 | davef
10.4. Pre-Cure Examination. Immediately after material application, the uncured conformal coating shall be examined for: a. Bubbles and Air Entrapments. These defects shall be broken by vacuum, with a sharp probe, or other appropriate tools. b. Bridg
Electronics Forum | Mon Aug 24 21:16:57 EDT 2020 | smith88
I am trying to teach a class and the question came up about loss of metalization of the Earth pad on a chip filter. This pad is on the side of the component. I can not find a IPC call out for this type of side termination other than 3 or 5 sided 9.1.
Electronics Forum | Thu Aug 09 16:24:27 EDT 2018 | ks0707
Hi Thomas, Thank you for your posting and I agree with you that Printing is the most difficult one. BTW, after you ran the one side (let's say Bottom side), my engineer worries about the distortion of flex board because of the thickness. In that ca
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