Industry News | 2011-08-24 17:13:21.0
The IPC Conference on Reliability: Assembly Process for a Reliable Product will be held November 1-2, 2011, in Irvine, Calif. The conference will address reliability issues that arise at the assembly level, dedicating half-day programs on new developments in each of three key areas: materials, processes, and test and inspection.
EKT AOI machine application: inspection after stencil printing, pre/post reflow oven, pre/post wave soldering?FPC etc. Stencil printing: Solder unavailability, insufficient or excessive solder, solder misalignment, bridging, stain, scratch etc. Compo
Technical Library | 2012-10-18 21:58:51.0
First published in the 2012 IPC APEX EXPO technical conference proceedings. In this paper, we report on a comprehensive study regarding the morphology evolution and voiding of SnAgCu solder joints on the central pad of two different packages – QFN and an Agilent package called TOPS – on PCBs with a Ni/Au surface finish.
Industry News | 2010-09-27 23:01:06.0
Christopher Associates/Koki Solder announces that Jasbir Bath will present a paper titled “An Investigation into the Development of Lead-Free Solder Paste for Package on Package (PoP) Component Manufacturing Applications” at the upcoming SMTAI Technical Conference, scheduled to take place October 25-28, 2010 at the Walt Disney World Swan and Dolphin Resort in Orlando, FL.
Industry News | 2012-08-29 16:15:27.0
Juki Automation Systems, announces that Mega Tech of Oregon (MTO) has begun production with its new KE-1080LN High-Speed Flexible Mounter.
Industry News | 2008-06-12 21:49:07.0
ScanWorks� integration into Cadence Encounter Digital IC Design Flow to provide deeper view into complex, packaged chips
Industry News | 2010-03-30 14:05:45.0
MORRISVILLE, NC - Juki Corporation is pleased to announce that Gerry Padnos, Director of Technology, will present a paper titled "PCB Assembly System Set-Up for Package-on-Package (PoP) Technology" at the upcoming IPC/APEX conference and exhibition.
Industry News | 2017-04-25 21:49:48.0
Nordson YESTECH recently installed a FX-940 ULTRA 3D AOI system at FormFactor, Inc. (NASDAQ:FORM) in Carlsbad. The world’s leading supplier of probe cards to manufacturers of DRAM, Flash and SoCs (System-on-Chip), FormFactor has a global network of 16 facilities and employs more than 1500 people. The company will utilize Nordson’s FX-940 ULTRA 3D AOI system for automated inspection of its complex probe card assemblies.
Industry News | 2012-08-28 08:13:26.0
NEPCON South China 2012 kicked off today at the Shenzhen Convention & Exhibition Center.
Electronics Forum | Tue Jul 25 13:40:04 EDT 2017 | davegoad
I have some CERSOT-23 transistor packages with castellated terminals. The 4th lead (drain castellation) is electrically connected to the top of the device by the castellation. The castellation goes up the ceramic body and contacts the metal package
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