Electronics Forum | Tue Mar 09 11:10:31 EST 2010 | baildl632
Graceyt, I know you are being shot a lot of info. Have you gotten any resolution to this problem? I've seen similar problems in our thermal chamber with Demodulation units. The IC, in the module, inside the radio inside the chamber at the top of ou
Electronics Forum | Tue Jul 01 17:38:24 EDT 2003 | jartman
I've faced this several times in the past, and the only real solution is to wirebond before SMT assembly. Everything leaves a residue, and trying to clean a residue off later is basically hopeless. This may require some trickery in your SMT process
Electronics Forum | Wed Apr 06 12:36:53 EDT 2005 | smt_rookie
I've tried a different lot of the same double header connector (yes its double level right angled header conector) twice but nothing has improved. I've also suspected that top row of the connector has greater heat sinking capacity (which should hold
Electronics Forum | Wed Apr 06 11:10:47 EDT 2005 | smt_rookie
We process a double-side reflow board (10 ups). Chips and IC's on the bottom side while chips, IC's plus thru-hole connectors and IC sockets on top side (bottom side first then top side reflow). In the past, we were not encountering any soldering pro
Electronics Forum | Tue Jun 27 09:12:15 EDT 2000 | james liang
hello all, DSS Model of cordless phone base unit during process TOP - REFLOW- FCT - BOTTOM - REFLOW - Wave solder and then the IC101 leg of RF unit lifted..?
Electronics Forum | Tue Oct 16 14:18:41 EDT 2012 | ericrr
My guess is a manual machine would be good for a after sales "repair station" or the engineers doing product development, without it you would have almost drop a large integrated circuit (IC) on to the spot and poke around with it moving it sideways
Electronics Forum | Fri Mar 04 10:04:14 EST 2005 | jbrower
We use Alpha UP-78 (Older paste formula) and it works well for what we do. We standardized our stencils at 5mil with a 10% reduction on IC apetures and a home plate design on passive components. Additionally we use laser cut electro-polished stenci
Electronics Forum | Wed Jun 03 15:22:12 EDT 1998 | Greg Curler
| | We have experienced poor adhesion of acrylic conformal coating to plastic bodied IC�s. The observed symptoms of this are a blistering or lifting of the coating at the surface of the component, although peel testing has revealed that this is not
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