New Equipment | Cleaning Agents
Aqueous Cleaner for Flip Chips and Advanced Packaging AQUANOX® A4520 is an aqueous blend designed to remove re-flowed pastes, tacky, no clean and a majority of lead free residues while exceeding industry standards for worker and environmental sa
Industry News | 2015-01-19 20:59:27.0
FCT Assembly today announced that it will present a new process for evaluating solder pastes in Booth #713 at the IPC APEX EXPO, scheduled to take place Feb. 24-26, 2015 at the San Diego Convention Center in California. Field application engineer, Tony Lentz, also will present the paper written on the new evaulation process titled “Dispelling the Black Magic of Solder Paste.” The presentation will be held during the Fluxes Technical Conference Session on Tuesday, Feb. 24 from 1:30-3 p.m.
Industry News | 2014-07-28 21:38:30.0
Juki Automation Systems (JAS), Inc. announces that it will exhibit the new RX Series in Booth # C2-1M70 at NEPCON South China, scheduled to take place August 26-28, 2014 at the Shenzhen Convention & Exhibition Center in Shenzhen, China.
Semi automatic type; all sizes available www.jwide-smt.com sales@jwide-smt.com
New Equipment | Cleaning Equipment
The Model 1550 Stencil & Pallet Cleaner is our most popular semi-automatic system. It is designed to clean stencils up to 29" x 29" (740 x 740 mm) and fully equipped with the following integrated options: Heated Wash Tank Filter Recirculator
Industry News | 2009-04-08 15:48:25.0
DENVER � April 2009 � Krayden, Inc., a leading distributor of engineered materials and Dow Corning's Distributor of the Year, announces that it will exhibit technologies from its industry-leading suppliers in booth 1141at the upcoming NEPCON East Exhibition and Conference, scheduled to take place April 22-23, 2009 at the Boston Convention & Exhibition Center in Boston, MA.
Technical Library | 2018-06-13 11:42:00.0
The art of screen printing solder paste for the surface mount community has been discussed and presented for several decades. However, the impending introduction of passive Metric 0201 devices has reopened the need to re-evaluate the printing process and the influence of stencil architecture. The impact of introducing apertures with architectural dimensions’ sub 150um whilst accommodating the requirements of the standard suite of surface mount connectors, passives and integrated circuits will require a greater knowledge of the solder paste printing process.The dilemma of including the next generation of surface mount devices into this new heterogeneous environment will create area ratio challenges that fall below todays 0.5 threshold. Within this paper the issues of printing challenging area ratio and their associated aspect ratio will be investigated. The findings will be considered against the next generation of surface mount devices.
Technical Library | 2006-10-02 14:26:47.0
This paper addresses the assembly and reliability of 0.5 mm pitch leadless Chip Scale Packages (CSP) on .062" immersion Ag plated printed circuit boards (PCB) using Pb-free solder paste. Four different leadless CSP designs were studied and each was evaluated using multiple PCB attachment pad designs.
Industry News | 2005-01-19 10:22:26.0
Indium Corporation of America recently awarded their annual Silver Quill Award for excellence in technical writing to two employees.
Industry News | 2013-02-04 14:14:48.0
Practical Components and its sister company Practical Tools will exhibit in booth A16 at the upcoming IPC APEX Expo
