Career Center | Reynosa, Mexico | Engineering
This position is in our Reynosa manufacturing facility, which is across the border from McAllen, Texas. In this critical role, you will be responsible for PCBA, SMT, THT, Wave Solder and secondary operations which will include: =Ensure producti
Industry News | 2023-10-23 09:22:43.0
ZESTRON is excited to announce an upcoming webinar titled "Cleaning Performance Evaluations and Best Practices for Novel Jettable Pastes for Advanced Packaging and SMT Assembly Process" on October 19th, 2023, at 2:00 PM EST.
Industry Directory | Consultant / Service Provider / Manufacturer
PROPOX is a manufacturer of electronics, industrial automatics, telemetric systems, tools, modules and evaluation circuits used by the constructors of electronics.
Technical Library | 2023-05-02 19:06:43.0
As 0402 has become a common package for printed circuit board (PCB) assembly, research and development on mounting 0201 components is emerging as an important topic in the field of surface mount technology for PWB miniaturization. In this study, a test vehicle for 0201 packages was designed to investigate board design and assembly issues. Design of Experiment (DOE) was utilized, using the test vehicle, to explore the influence of key parameters in pad design, printing, pick-andplace, and reflow on the assembly process. These key parameters include printing parameters, mounting height or placement pressure, reflow ramping rate, soak time and peak temperature. The pad designs consist of rectangular pad shape, round pad shape and home-based pad shape. For each pad design, several different aperture openings on the stencil were included. The performance parameters from this experiment include solder paste height, solder paste volume and the number of post-reflow defects. By analyzing the DOE results, optimized pad designs and assembly process parameters were determined.
New Equipment | Cleaning Agents
AQUANOX® A4241 is an aqueous cleaning solution designed with revolutionary inhibition technology to be effective on the toughest soils while protecting even the most sensitive parts from etch or darkening. AQUANOX® A4241can be used in multi-p
New Equipment | Cleaning Agents
AQUANOX® A4625B is an innovative aqueous chemistry designed for optimum effectiveness in batch washers. This easy to use product will remove all types of electronic flux residues including the latest lead free. AQUANOX® A4625B is environmentally fri
Technical Library | 2020-10-27 02:07:31.0
For companies that choose to take the Pb-free exemption under the European Union's RoHS Directive and continue to manufacture tin-lead (Sn-Pb) electronic products, there is a growing concern about the lack of Sn-Pb ball grid array (BGA) components. Many companies are compelled to use the Pb-free Sn-Ag-Cu (SAC) BGA components in a Sn-Pb process, for which the assembly process and solder joint reliability have not yet been fully characterized. A careful experimental investigation was undertaken to evaluate the reliability of solder joints of SAC BGA components formed using Sn-Pb solder paste. This evaluation specifically looked at the impact of package size, solder ball volume, printed circuit board (PCB) surface finish, time above liquidus and peak temperature on reliability. Four different BGA package sizes (ranging from 8 to 45 mm2) were selected with ball-to-ball pitch size ranging from 0.5mm to 1.27mm. Two different PCB finishes were used: electroless nickel immersion gold (ENIG) and organic solderability preservative (OSP) on copper. Four different profiles were developed with the maximum peak temperatures of 210oC and 215oC and time above liquidus ranging from 60 to 120 seconds using Sn-Pb paste. One profile was generated for a lead-free control. A total of 60 boards were assembled. Some of the boards were subjected to an as assembled analysis while others were subjected to an accelerated thermal cycling (ATC) test in the temperature range of -40oC to 125oC for a maximum of 3500 cycles in accordance with IPC 9701A standard. Weibull plots were created and failure analysis performed. Analysis of as-assembled solder joints revealed that for a time above liquidus of 120 seconds and below, the degree of mixing between the BGA SAC ball alloy and the Sn-Pb solder paste was less than 100 percent for packages with a ball pitch of 0.8mm or greater. Depending on package size, the peak reflow temperature was observed to have a significant impact on the solder joint microstructural homogeneity. The influence of reflow process parameters on solder joint reliability was clearly manifested in the Weibull plots. This paper provides a discussion of the impact of various profiles' characteristics on the extent of mixing between SAC and Sn-Pb solder alloys and the associated thermal cyclic fatigue performance.
Industry News | 2015-01-05 20:09:12.0
Speedprint Technology will highlight the SP710 Screen Printer at the SMTA Rocky Mountain Expo & Tech Forum, scheduled to take place Wednesday, January 28, 2015 at the West Club at Mile High Stadium in Denver, CO. Speedprint representatives will discuss the benefits of the SP710, Advanced Dispense Unit +, Velocity Plus and SPI communication system.
Industry News | 2015-01-20 17:45:54.0
Speedprint Technology will showcase the award-winning SP710 Screen Printer in Booth #2833 at the IPC APEX EXPO, scheduled to take place Feb. 24-26, 2015 at the San Diego Convention Center in California. Speedprint prides the SP710 for low ownership costs, flexibility, ease of maintenance and overall value.
Industry News | 2015-08-26 18:18:15.0
Speedprint Technology will showcase the award-winning SP710 Screen Printer in Booth #821 at SMTA International, scheduled to take place Sep. 29 - 30, 2015 at the Donald Stephens Convention Center in Rosemont, IL. Speedprint prides the SP710 for low ownership costs, flexibility and ease of maintenance. Having achieved outstanding reliability, each Speedprint unit is backed by the industry’s best warranty with five-years on parts and two-years on labor.
