Full Site - : solder paste not good image (Page 9 of 15)

QFN PCB Pad no Drain Hole

Electronics Forum | Fri May 31 12:50:42 EDT 2013 | spoiltforchoice

Is this a "thermal balance" issue? In the 2nd image you have a group of pads blobbed together as one giant pad. IMHO this is a bad idea, QFN's rely heavily on the magic of your paste and good PCB design to get good alignment. When your solder paste i

SOT Solder Problem

Electronics Forum | Mon Aug 11 15:44:41 EDT 2008 | stimpk

Although its a fairly rough image to look at I'd think you more of a reflow or paste issue. Looking at the two resistors, they don't look so good either. Although they maintained their placement alignment the solder does'nt appear to have flowed cor

Solder Paste Thickness Measuring Device

Electronics Forum | Fri Mar 19 16:21:26 EST 2004 | davem

Steve is right, Cyberoptics and ASC are the 2 main players in this market. I've used machines produced by both manufacturers and they both do a pretty good jod provided the operators know what they're doing. The LSM and LSM2 are solid but aging mac

AOI: Comparisons

Electronics Forum | Tue Aug 31 02:15:12 EDT 2004 | AOI Solution

I need to address the issue for colorful display on solder joints, for whoever researched on this machine, no one can deny it is a smart feature for visual assistance. however, it is still Mono color "gray scale" algorithm. it basically "paint" the i

Agilent 5DX

Electronics Forum | Thu Jan 29 19:01:51 EST 2009 | stevek

Allow me a contrary viewpoint. I've had these things on my floor and had customers get outsourced evaluations done with them. Most expensive boat anchors I've run across. First the good points: The automated scanning and pattern recognition is go

Re: BGA REFLOW PROBLEMS

Electronics Forum | Mon Mar 27 20:48:25 EST 2000 | Dave F

Robert: Howya doin' bud? You say "BGA Shorting!!!" I say "Too Much Solder!!!" So, earlier comments about aperture design are appropriate, make good points, and I think we both agree that improvements could be made in your stencil design, but I'm

MELF component/solder failure

Electronics Forum | Thu May 08 10:16:17 EDT 2003 | davef

Observations are: * Center most lead of the fuse on the top right of the assembly looks like it has excellent solder flow, but this is PTH. From the amount of solder, it must have been wave or hand soldered. * Center most lead of the fuse on the bot

Re: STENCIL CLEANING WITH SOLVENTS

Electronics Forum | Tue Nov 16 14:10:30 EST 1999 | Bill Schreiber

According to a paper by Richard Clouthier, published in 1996, there are two major factors about normal cleaning chemistries that may affect stencil adhesives. 1) Elevated temperature above 110 degrees F. (45 degrees C). Stencil adhesives are heat c

Re: X-Ray for CSP devices

Electronics Forum | Tue Jul 20 09:59:22 EDT 1999 | Vikram Butani

Hi Steve, What Earl says is true. You need a stand alone failure analysis/process verification system before you go inline. No matter what brand you choose, it is important to compare a few features, across the board: - X-ray source kV, mA, and f

Re: BGA Inspection Criteria

Electronics Forum | Sun Dec 10 11:55:16 EST 2000 | Bob Willis

The following may be of interest to you. INTRODUCTION TO X-RAY INSPECTION All text Copyright Bob Willis, EPS INTRODUCTION TO X-RAY INSPECTION The use of X-ray inspection is becoming very popular due to the increased use of Ball Grid Array (BGA)


solder paste not good image searches for Companies, Equipment, Machines, Suppliers & Information

2024 Eptac IPC Certification Training Schedule

Training online, at your facility, or at one of our worldwide training centers"
2024 Eptac IPC Certification Training Schedule

Nozzles, Feeders, Spare Parts - Siemens, Fuji, Juki, Yamaha, etc...
SMT Machines

High Precision Fluid Dispensers
Assembly Automation Technology

SMT & PCB Equipment - MPM, DEK, Heller, Europlacer and more...