Full Site - : solder paste on pcb

SMTA (Surface Mount Technology Association) all day Chapter Meeting at Textron Defense Systems on Tues., June 26, 2012:

Industry News | 2012-06-18 14:49:38.0

Reliability and Failure Analysis Seminar: Lessons Learned in Manufacturing. Presented by Universal Instruments Corporation’s Advanced Process Laboratory. Hosted by Textron Defense Systems, 201 Lowell St., Wilmington, MA

Surface Mount Technology Association (SMTA)

IPC Releases New IPC/PERM-2901, Pb-free Design and Assembly Implementation Guide IPC-PERM-2901 addresses the impact of Pb-free on reliability and service life for aerospace, defense and high-performa

Industry News | 2018-02-19 13:55:53.0

IPC — Association Connecting Electronics Industries® Pb-free Electronics Risk Management (PERM) Council has developed the first single document dedicated solely to assisting design engineering in the development of electronics that are completely lead-free (Pb-free) and meet the demanding requirements of aerospace, defense and high performance (ADHP) products and systems.

Association Connecting Electronics Industries (IPC)

IPC and CALCE Present 7th International Symposium on Tin Whiskers Event to Feature Experts from CALCE, Lockheed Martin and Other Leading Organizations

Industry News | 2013-10-01 18:21:25.0

IPC — Association Connecting Electronics Industries® and its educational partner, CALCE® (Center for Advanced Life Cycle Engineering) at the University of Maryland, will host the 7th International Symposium on Tin Whiskers, November 12–13, 2013, in Costa Mesa, Calif.

Association Connecting Electronics Industries (IPC)

Practical Support on Cleaning and Contamination Monitoring Processes Printed Board Assembly Cleaning and Contamination Testing Center to Debut at IPC APEX EXPO 2013

Industry News | 2012-12-03 19:52:39.0

Printed Board Assembly Cleaning and Contamination Testing Center marks its debut at IPC APEX EXPO®, February 19–21, 2013, at the San Diego Convention Center.

Association Connecting Electronics Industries (IPC)

IPC Extends Deadline on Call for Participation for IPC APEX EXPO 2017 Deadline for technical conference paper abstracts extended to: July 8, 2016

Industry News | 2016-07-02 06:45:13.0

IPC — Association Connecting Electronics Industries® has extended the deadline of their invitation for engineers, researchers, academics, technical experts and industry leaders to submit abstracts for IPC APEX EXPO 2017 to be held at the San Diego Convention Center. Professional development courses will take place February 12, 13 and 16, 2017 and the technical conference will take place February 14–16, 2017. The extended deadline is July 8, 2016.

Association Connecting Electronics Industries (IPC)

IPC Extends Deadline on Call for Participation for IPC APEX EXPO 2018 Deadline for technical conference paper abstracts extended to: July 21, 2017

Industry News | 2017-07-17 18:33:56.0

IPC — Association Connecting Electronics Industries® has extended the deadline of their invitation for engineers, researchers, academics, technical experts and industry leaders to submit abstracts for IPC APEX EXPO 2018 to be held at the San Diego Convention Center. Professional development courses will take place February 25, 26 and March 1, 2018 and the technical conference will take place February 27–March 1, 2018. The extended deadline for technical conference abstracts is July 21, 2017.

Association Connecting Electronics Industries (IPC)

IPC Extends Deadline on Call for Participation for IPC APEX EXPO 2019 Deadline for technical conference paper abstracts extended to: June 29, 2018

Industry News | 2018-06-20 20:36:50.0

IPC — Association Connecting Electronics Industries® has extended the deadline of their invitation for engineers, researchers, academics, technical experts and industry leaders to submit abstracts for IPC APEX EXPO 2019 to be held at the San Diego Convention Center. The technical conference will take place January 29–31, 2019. The extended deadline for technical conference abstracts is June 29, 2018.

Association Connecting Electronics Industries (IPC)

SHENMAO America, Inc. exhibits at local SMTA Exhibition at Bestronics, San Jose, CA Facility on November 29 - Introduces 2 new Solder paste formulations.

Industry News | 2017-11-24 20:19:27.0

SHENMAO Introduces New Generation Lead-Free Solder Paste PF606-P140 to solve HoP issues and improve ICT Testability at SMTA Exhibition: November 29, 2017 booth # 22, 9 am to 3 pm Bestronics Facility, 2243 Lundy Ave, San Jose, CA 95131

Shenmao Technology Inc.

CSP rework on mobile phone board

CSP rework on mobile phone board

Videos

Chip Scale Package Rework of a 3x3 mm µBGA component on a mobile phone board. The Fineplacer® core rework system handles all aspects of the rework cycle: http://eu.finetech.de/advanced-rework/products/fineplacer-core-rework-station.html

Finetech

MicroTech Manufacturing Standardizes on Cobar SN100C-XF3

Industry News | 2009-08-20 15:16:57.0

August 2009 — Cobar Solder Products, part of the Balver Zinn Group, announces that MicroTech Manufacturing, a contract manufacturer in the Phoenix area, now is using Cobar SN100C-XF3 as the standard lead-free solder paste for all its customers unless specifically directed to use a different material.

Balver Zinn


solder paste on pcb, time searches for Companies, Equipment, Machines, Suppliers & Information

Count On Tools, Inc.
Count On Tools, Inc.

COT specializes in high quality SMT nozzles and consumables for pick and place machines. We provide special engineering design service of custom nozzles for those unique and odd components.

Manufacturer

2481 Hilton Drive
Gainesville, GA USA

Phone: (770) 538-0411

SMT feeders

Software for SMT placement & AOI - Free Download.
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Training online, at your facility, or at one of our worldwide training centers"
SMTAI 2024 - SMTA International

Nozzles, Feeders, Spare Parts - Siemens, Fuji, Juki, Yamaha, etc...
2024 Eptac IPC Certification Training Schedule

Easily dispense fine pitch components with ±25µm positioning accuracy.
Electronic Solutions R3

Thermal Transfer Materials.