Industry News | 2012-02-28 14:00:06.0
IPC presented Presidents, Special Recognition, Distinguished Committee Leadership and Committee Service Awards at IPC APEX EXPO® at the San Diego Convention Center.
Industry News | 2011-02-19 18:32:03.0
From a record number of technical abstract submissions, the best papers in PCB and electronics manufacturing and assembly were selected for presentation at the IPC APEX EXPO™ Technical Conference, April 12–14, 2011 in Las Vegas. Featuring new research and innovations from industry experts around the world, the IPC APEX EXPO Technical Conference will cover more than 30 technical topics to provide the industry with practical solutions and new opportunities for the future.
Industry News | 2013-05-01 12:45:51.0
Held at the Rijckholt Castle and Nordson ASYMTEK European Headquarters in Maastricht
Industry News | 2023-06-07 19:51:18.0
Funds would help ensure success of the CHIPS Act and Biden's "Presidential Determination" on PCBs
Industry News | 2010-03-27 19:35:44.0
BANNOCKBURN, Ill., USA, - IPC — Association Connecting Electronics Industries® announced today the February findings from its monthly North American Printed Circuit Board (PCB) Statistical Program.
Industry News | 2007-10-05 21:28:08.0
MINNEAPOLIS, MN - During the Annual Meeting at SMTA International (Wednesday, October 10th, at the Gaylord palms Resort in Orlando, FL.), the association honored members who have shown exceptional service to the association and the industry.
Industry News | 2011-04-20 21:26:17.0
IPC — Association Connecting Electronics Industries® presented Special Recognition, Distinguished Committee Leadership and Committee Service awards and a Presidents Award at IPC APEX EXPO™, held April 10–14, in Las Vegas.
New Equipment | Solder Paste Stencils
Sometimes there are products that come along and you think to yourself-Wow! The StikNPeel™ rework stencil is one of those products. It simplifies the rework of site locations by placing a highly flexible, removable, adhesive-backed stencil on to a ci
Technical Library | 2007-01-31 15:17:04.0
The goal of this project is to evaluate the reliability of lead-free BGA solder joints with a variety of different pad sizes using several different BGA rework methods. These methods included BGAs reworked with both flux only and solder paste attachment techniques and with or without the use of the BEST stay in place StencilQuick™. The daisy chained test boards were placed into a thermal test chamber and cycled between -25ºC to 125ºC over a 30 minute cycle with a 30 minute dwell on each end of the cycle. Each BGA on the board was wired and the continuity assessed during the 1000 cycles the test samples were in the chamber.
.gif)
