Flason SMT Automatic SMT 1200mm Solder paste printer for SMT assembly line Power Supply: AC:220±10%,50/60HZ Control Method: PC Control PCB Size/Max:1200*340mm Weight Approx:1500Kg Product description: Automatic1200mm SMT Solder paste p
Flason SMT Automatic SMT 1200mm Solder paste printer for SMT assembly line Power Supply: AC:220±10%,50/60HZ Control Method: PC Control PCB Size/Max:1200*340mm Weight Approx:1500Kg Product description: Automatic1200mm SMT Solder paste pr
Flason SMT Automatic 1200mm Solder paste printer for SMT assembly line Power Supply: AC:220±10%,50/60HZ Control Method: PC Control PCB Size/Max:1200*340mm Weight Approx:1500Kg Product description: Automatic1200mm Solder paste printer f
SMT Assembly line Power Supply: AC:220±10%,50/60HZ Control Method: PC Control PCB Size/Max:1200*340mm Weight Approx:1500Kg Product description: Automatic1200mm Solder paste printer for SMT assembly line-Good Price! Good Quality! Good
China Automatic Solder paste printer for SMT assembly line Factory Supplier Power Supply: AC:220±10%,50/60HZ Control Method: PC Control PCB Size/Max: 850*500mm Weight Approx:1300Kg Product description: China Automatic Solder paste print
Flason SMT China Automatic Solder paste printer for SMT assembly line Factory Supplier Power Supply: AC:220±10%,50/60HZ Control Method: PC Control PCB Size/Max: 850*500mm Weight Approx:1300Kg Product description: China Automatic Solder
Flason SMT China Automatic Solder paste printer for SMT assembly line Factory Supplier Power Supply: AC:220±10%,50/60HZ Control Method: PC Control PCB Size/Max: 850*500mm Weight Approx:1300Kg Product description: China Automatic Solder
New Equipment | Soldering - Other
SMT Stencil Printer Automatic 1200mm Solder paste printer for SMT assembly line Power Supply: AC:220±10%,50/60HZ Control Method: PC Control PCB Size/Max:1200*340mm Weight Approx:1500Kg Product description: Automatic1200mm So
Technical Library | 2023-07-25 16:50:02.0
Some of the new handheld communication devices offer real challenges to the paste printing process. Normally, there are very small devices like 01005 chip components as well as 0.3 mm pitch uBGA along with other devices that require higher deposits of solder paste. Surface mount connectors or RF shields with coplanarity issues fall into this category. Aperture sizes for the small devices require a stencil thickness in the 50 to 75 um (2-3 mils) range for effective paste transfer whereas the RF shield and SMT connector would like at least 150 um (6 mils) paste height. Spacing is too small to use normal step stencils. This paper will explore a different type of step stencil for this application; a "Two-Print Stencil Process" step stencil. Here is a brief description of a "Two-Print Stencil Process". A 50 to 75 um (2-3 mils) stencil is used to print solder paste for the 01005, 0.3 mm pitch uBGA and other fine pitch components. While this paste is still wet a second in-line stencil printer is used to print all other components using a second thicker stencil. This second stencil has relief pockets on the contact side of the stencil any paste was printed with the first stencil. Design guidelines for minimum keep-out distances between the relief step, the fine pitch apertures, and the RF Shields apertures as well relief pocket height clearance of the paste printed by the first print stencil will be provided.
New Equipment | Solder Paste Stencils
EasyBraid’s stencil rolls are designed for use in SMT screen printing lines which keep stencil apertures clear of paste residues during the automatic screen printing process. They also clean the bottom of stencils, keeping them free from paste and fl