Full Site - : solder paste staying on squeegee (Page 5 of 6)

Epoxy on bottom of SMT component

Electronics Forum | Tue Nov 27 07:44:59 EST 2007 | davef

We do not paste when we glue. We glue components so they will stay inplace during wave soldering. In wave soldering there is ample solder to bridge the standoff between the component and the pad.

Blow hole on pad after reflow oven

Electronics Forum | Mon Jan 24 06:19:04 EST 2011 | fönsi

Hello! I've had the same problem about one Jear ago. We had exessive building of voids in the solder joints. I recomment to take a pincer to break off some of the components. If the solder joint is good, the copper pad will stay at the solder joint

Re: Non soldered leads on ic's

Electronics Forum | Fri Feb 19 09:14:52 EST 1999 | Justin Medernach

| During inspection and test we find leads which do not get soldered. Some are because of insufficient paste, but with others everything looks right. This will only happen on 1 to 2 pins, and it is not isolated to a specific type of ic or location o

LGA component rework process on SRT machine

Electronics Forum | Fri Jun 04 11:54:22 EDT 2021 | cbart

We do this quote often with our older Summit machine. there are a few ways to do this. all of these are assuming you have parts on the boards already and are working around them. 1- if you have a good tech that can add solder to the pads on the PCB a

Re: PTH connectors mounted on SMD process

Electronics Forum | Tue Dec 21 17:58:44 EST 1999 | Brian W.

When doing PIH processes, it is critical that you control the solder VOLUME, not the height. You must define the process, monitor it and control chart it to keep the paste volume consistent. You have do some careful engineering to determine how muc

Re: Adhesion loss on passives over wave

Electronics Forum | Fri Mar 19 11:01:42 EST 1999 | Dave F

| Hi folks, | | I am looking for inputs on a long-standing problem encountered in our shop: Bottom-side parts (passives) falling off in the Wave...where the only remnants of the part is a flattened glue dot of proper diameter and volume, and somet

Re: PTH connectors mounted on SMD process

Electronics Forum | Wed Dec 29 14:30:28 EST 1999 | Dan Woodward

I am not sure if I have seen an article comparing solder joint strength Vs pressfit although I am sure this has been researched by literally hundreds of companies before they felt comfortable going to pressfit. I know one of the issues with solder is

baked on water soluble flux residue betwwen fine pitch comp.

Electronics Forum | Fri Dec 01 14:12:50 EST 2000 | Jim M.

My company currently uses water soluble paste for our SMT process. We were having trouble retaining hot water in our in line, closed loop DI cleaner. The cleaner kept shutting down when the water temp. dropped below 125C. As a result, the conveyor

Re: Solder Paste and Stencil questions

Electronics Forum | Tue Oct 12 22:22:34 EDT 1999 | se

| Hi, | We are in the process of evaluate our solder paste,incoming inspection over the solder paste, stencil requirments: | | 1- Is anybody using/requiring 1000 Kcps or more on viscosity to your solder paste provider ? Why ?? | 2- Is anybody using


solder paste staying on squeegee searches for Companies, Equipment, Machines, Suppliers & Information

Count On Tools, Inc.
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