Industry Directory | Manufacturer
Reflow ovens for automated SMT PCB assembly, specializing in lead free processing and nitrogen reflow. The best convection reflow ovens on the market.
Industry Directory | Manufacturer
A US manufacturer of quality hand tools for those engaged in the repair, rework, R & D, testing, and assembly of electronic components and printed circuit boards from Through Hole to 2Mil Pitch Surface Mount.
Retrofit existing system with Innovative Dispensing Technology for Excellent Dispense Control and Repeatability Advanced pump technologies available for retrofitting include: True Volumetric Pump, Precision Auger Pump, Simplified Jetting Pump and Ti
When Applications Require Large Board Processing &/or Versatility The DS Series of dispensers is a robust, large format platform designed to handle all types of applications with ease. Ideal for dispense applications utilizing adhesive, solder paste
Electronics Forum | Tue Feb 03 19:56:43 UTC 2026 | SMTA-81449947
Hello all, I have a PCB I want to run through wave solder with test points(keep out areas) really close to the solder joints. When designing a wave solder pallet, what is the minimum keep out distance from the pallet opening to the desired solder joi
Electronics Forum | Thu Feb 12 20:42:10 UTC 2026 | SMTA-64387381
Is there any good reason not to print solder paste on DNPs on ENIG plated PCBs? Want to use a single stencil for building several BOM configurations on a common PCB. The in house design team is saying they do not allow printing on the DNP pads.
Used SMT Equipment | X-Ray Inspection
Test Research TRI, TR 7006L 3D Solder Paste Inspection, Located In Fremont, CA An auction item: bidding on this listing starts on Wednesday, September 20, 2017 6:00:00 AM
Used SMT Equipment | Visual Inspection
Condition: Complete & Fully Operational
Industry News | 2023-10-18 17:43:18.0
HELLER's High UPH Vacuum Reflow Oven clinched the coveted "Step-by-Step Excellence Awards" - Innovation Award owing to its industry-leading product strength and outstanding performance.
Technical Library | 2023-01-17 17:19:44.0
A test program was developed to evaluate the effectiveness of vacuum reflow processing on solder joint voiding and subsequent thermal cycling performance. Area array package test vehicles were assembled using conventional reflow processing and a solder paste that generated substantial void content in the solder joints. Half of the population of test vehicles then were re-processed (reflowed) using vacuum reflow. Transmission x-ray inspection showed a significant reduction in solder voiding after vacuum processing. The solder attachment reliability of the conventional and vacuum reflowed test vehicles was characterized and compared using two different accelerated thermal cycling profiles. The thermal cycling results are discussed in terms of the general impact of voiding on solder thermal fatigue reliability, results from the open literature, and the evolving industry standards for solder voiding. Recommendations are made for further work based on other void reduction methods and additional reliability studies.
Technical Library | 2023-01-17 17:22:28.0
The impact of voiding on the solder joint integrity of ball grid arrays (BGAs)/chip scale packages (CSPs) can be a topic of lengthy and energetic discussion. Detailed industry investigations have shown that voids have little effect on solder joint integrity unless they fall into specific location/geometry configurations. These investigations have focused on thermal cycle testing at 0°C-100°C, which is typically used to evaluate commercial electronic products. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC- 9701 specification for tin/lead solder alloys. This temperature range is more typical of military and other high performance product use environments. A proposed BGA void requirement revision for the IPC-JSTD-001 specification will be extracted from the results analysis.
http://www.gpd-global.com No drip no drool across a wide range of fluid viscosities (low-to-mid and low-to-high). No manual adjustment to compensate for pump variability. Truly Volumetric PCD Pumps for total control of dispensing fluids. Ability to
When Applications Require Large Board Processing &/or Versatility The DS Series of dispensers is a robust, large format platform designed to handle all types of applications with ease. Ideal for dispense applications utilizing adhesive, solder paste
Training Courses | ON DEMAND | | Other Courses
Other courses related to electronics manufacturing and assembly
Training Courses | ON DEMAND | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Events Calendar | Sun Apr 11 18:30:00 UTC 2021 - Sun Apr 11 18:30:00 UTC 2021 | ,
Europe Chapter Webinar: Tombstoning Components during Reflow Soldering - Causes & Cures
Events Calendar | Tue May 30 18:30:00 UTC 2023 - Tue May 30 18:30:00 UTC 2023 | Holtsville, New York USA
Long Island Chapter Meeting: Fine Feature Paste Printing, Stencil Design and Solder Technology
Career Center | Rolling Meadows, Illinois USA | Production
Family-oriented specialized PCB test, rework and repair facility seeks several highly skilled technicians. If you are highly skilled then come work with among the best soldering and PCB test and repair technicians in the US. Relevant Work Experience
Career Center | Fremont, California USA | Production,Quality Control
Local industry leading EMS Company seeking SMT operators. Will be doing SMT line Change overs, SMT machine operation for solder printing, placement, reflow. Solder paste height measurement and record. Solder printing quality check after solder paste
Career Center | Chennai, Tamil Nadu India | Engineering,Maintenance,Production,Research and Development,Technical Support
Over 5.5 years exp in Customer service on SMT Roles and Responsibilities Identify, improve, recommend, and implement measures to improve production methods, equipment performance, process capability, and product quality. Streamline manufac
Career Center | Georgetown, Penang | Engineering
Philips Lumileds Lighting Sdn. Bhd Position Title : SMT Engineer Specialization : Manufacturing/Production Operations Industry : Electrical & Electronics Duration : May 2006 - Present Work Description: To conduct NPI & all SMT related process in Lu
1st Place Machinery Inc. | http://www.firstplacemachinery.com/first_place_smt_pcb_aoi_cyberoptics.html
Cyberoptics Solder Paste Cyberoptics Solder Paste Inspection Model Number: SE200 2D/3D Solder Paste Inspection 115 volt Serial Number: 45026 Year: July 2000 Includes Monitor - Keyboard - Mouse No Manual
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types-2020/solder-fatigue-test
Solder fatigue test X-Ray Inspection and Test Products Corporate | Global Directory | Languages Division Only All of Nordson Home Products Bondtesting Systems Micro Materials Testing Wafer Inspection and Metrology X-ray Inspection Systems X-ray Counting Systems Applications Battery
