Electronics Forum | Mon Jan 09 19:55:32 EST 2006 | davef
"Poor release" (paste hanging-up in the stencil holes) could have three main (or combination of) causes: 1 Equipment * Proper aperture area ratio provide better release * Laser cut release better than chemical etched stencil 2 Process * Snap-off dis
Electronics Forum | Tue Aug 01 08:52:53 EDT 2006 | davef
We never changed any thing after moving to imm silver. "Poor release" (paste hanging-up in the stencil holes) could have three main (or combination of) causes: 1 Equipment * Proper aperture area ratio provide better release * Laser cut release bette
Electronics Forum | Mon Jul 26 11:01:35 EDT 1999 | Kevin Hussey
| Has anyone ever heard of testing solder paste quality by pasting a board and making a determination of the quality by measuring paste height and width after the board is pasted. Would you consider this a valid test for solder paste testing? | I ha
Electronics Forum | Sat Jun 25 00:52:31 EDT 2005 | ktron
Hi all, Recently I had problem with printing the lead free solder paste, almost every board has bridging especially on the fine pitch locations. Anyway this problem never happens when we use leaded solder paste. So I would like to ask if there are a
Electronics Forum | Thu Jun 24 14:34:13 EDT 2004 | tjensen
There are many factors that can lead to solder balls. Since you have just recently seen this start to occur, it is obvious something has changed in the product or your process. Since we don't have a lot of details about your process, I would sugges
Electronics Forum | Mon Feb 07 12:47:18 EST 2005 | Indy
1. use 6-7mils stencil. 2. reduce aperture opening to 60-70% of pad size. 3. check viscosity of solder paste. According to that you might want to alter your print speed and pressure. Cheers Indy
Electronics Forum | Mon May 14 16:52:19 EDT 2001 | John
We have been running a product for the past several months using Loctite 3615 in our adhesive dispenser (Camalot 3800). The program the machine has been running has gone unchanged for quite some time now and everything has run well. Today, it appea
Electronics Forum | Tue Jan 25 20:19:24 EST 2000 | Charley Qin
Hi, Mark Acturally, solder paste viscosity reading is very closely related to eviroment such as temperature and relative humidity. So I'm afraid it is hard to tell the diffrence between measurements without enviroment control. Regarding to LSM, we'v
Electronics Forum | Sun Sep 27 22:39:55 EDT 2009 | rajeshwara
The same issue i faced 2 yrs before , i sugest 1. Use stencil of 4 mils ( Take care of Aspect Ratio and Area Ratio ). 2. Use Solder Paste of Type 4.5 and Viscosity in between 1100 to 1300. ( Try Solder Paste of Cookson or Alpha metals : OM338 T45-L
Electronics Forum | Wed Aug 23 17:06:40 EDT 2000 | Dr. Ning-Cheng Lee
For 20 mil pitch pads, the volume control is more critical in terms of bridging concern. In general, solder paste for dispensing is more prone to slumping due to low metal load and low viscosity. If the volume dispensed is on the high end, or if the
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