Full Site - : solder paste volume for dia (Page 7 of 24)

Austin American Technology offers Cash for Clunkers

Industry News | 2009-08-07 14:33:53.0

AAT has decided to create its own Cash for Clunkers program. While the economic indicators in this industry are not very favorable, AAT thinks that by implementing its own stimulus program we can ease the burden in the electronics industry by offering OEM's and CEM's that have outdated or technically distressed PCB cleaning equipment the opportunity to receive a rebate to apply towards a new AAT batch or inline system.

Austin American Technology

SHENMAO Exhibits at SEMICON WEST July 11-13, 2017 Booth # 5716 Introduces New Tacky Flux SMF-WC52 for Flip Chip Technology

Industry News | 2017-07-09 20:40:11.0

SHENMAO Technology, Inc. introduces New Generation Ultra Tacky Flux SMF-WC52 applied in the Flip Chip dipping process. Its high tacky property keeps Chip in place during reflow for excellent soldering performance, while creating outstanding solder joint strength.

Shenmao Technology Inc.

Looking for SPI & AOI Systems for Our Chicago Production Area

Industry News | 2015-07-20 07:36:12.0

SMTA/NPL Printing & Assembly Automatic Optical Inspection Experience is a special feature we are organising in Chicago this year and we are looking for Solder Paste Inspections SPI and Automatic Optical Inspection systems to test our specially produced boards. If you would like to show your technology contact us bobwillis@smta.org

ASKbobwillis.com

Jetting Strategies for mBGAs a question of give and take...

Technical Library | 2015-04-02 20:12:58.0

The demands on volume delivery and positioning accuracy for solder paste deposits are increasing as the size and complexity of circuits continue to develop in the electronics industry. According to the iNEMI 2013 placement accuracy for these kinds of components will reach 6 sigma placement accuracy in X and Y of 30 um by 2023.This study attempts to understand the dependencies on piezo actuation pulse profile on jetting deposit quality, especially focused on positioning, satellites and shape. The correlation of deposit diameter and positioning deviation as a function of piezo actuation profile shows that positioning error for deposits increase almost monotonically with decreasing droplet volume irrespective of the piezo-actuation profile. The trends for shape and satellite levels are not as clear and demand further study.

Mycronic AB

Dispensing: A Robust Process Solution for Shield Edge Interconnect

Technical Library | 2023-11-06 17:08:44.0

A new process has been developed for RF shielding on compact electronic communications devices using automated solder paste dispensing. The process is known as Shield Edge Interconnect (SEI). SEI designs enable parts to be processed though underfill before placing of the RF shield and allows more complete use of valuable PCB real estate to achieve reduced form factor requirements and/or for added components on products such as smartphones and tablets. The reduced form factor creates challenges for the assembly of those devices. This process, enabled by Speedline dispensing technology, relies on extremely accurate dispensing of solder paste on copper traces located along the outer edge of the PCB. The result is a robust process solution for SEI in which proprietary closed loop dispenser, pump, vision, and software technologies enable a high volume manufacturing (HVM) process.

Speedline Technologies, Inc.

Insituware Wins Mexico Technology Award for New Vision MARK-1 Conformal Coating Fitness for Use Kit

Industry News | 2021-11-05 07:37:48.0

Insituware LLC received a 2021 Mexico Technology Award in the category of Conformal Coating for the Vision MARK-1 Conformal Coating Fitness for Use Kit. The award was announced during a ceremony that took place Wednesday, Nov. 3, 2021 during SMTA International in Minneapolis, MN.

Insituware LLC

SHENMAO Introduces PF606-P269J Lead-Free Paste Specially Designed for Jet Dispensing

Industry News | 2022-08-14 14:26:09.0

SHENMAO America, Inc. offers PF606-P269J Lead-Free Jetting Solder Paste specially designed for the jetting process. It offers excellent workability and solderability for automatic high-speed jetting production with superior accuracy and precision.

Shenmao Technology Inc.

Indium8.9HFA Solder Paste Sees Accelerated Adoption for Miniaturized Assemblies

Industry News | 2013-11-01 13:32:41.0

Indium Corporation's Indium8.9HFA Solder Paste is a versatile, halogen-free, Pb-free, solder paste with leading print performance on miniaturized components. Assemblers and OEMs are adopting this remarkable new product at an accelerating pace.

Indium Corporation

Viscom Scores NPI Award for Its SPI-AOI Uplink Function

Industry News | 2013-03-07 06:42:15.0

Viscom announces that it has been awarded a 2013 NPI Award in the category of Software – Process Control for its SPI-AOI Uplink function.

Martel Marketing Communications, Inc.

Semi-Kinetics Relies on PEMTRON for Quality Solder Paste Inspection

Industry News | 2024-06-24 09:13:51.0

Semi-Kinetics utilizes PEMTRON's advanced solder paste inspection systems to ensure the highest quality in their manufacturing processes. The company operates four PEMTRON SATURN SPI systems, which have become integral to their quality assurance protocols.

Semi-Kinetics


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