Industry News | 2022-04-28 15:05:22.0
In times of climate change and increases in energy use, the demands of power modules for the efficient and reliable control of electric motors continue to rise. Modern module concepts are reaching their limits in terms of power density, current carrying capacity, and reliability to increase lifetime and reduce costs. A critical area for improving power modules is the material system used in them, as well as their electrical and thermal interconnection.
Industry News | 2008-09-08 18:17:57.0
Essemtec's new stencil printer SP003-ML-V is a highly reliable system aimed at small and medium production volumes. Control of print quality and correction of print position is made easy and fast using the integrated vision system.
Industry News | 2018-09-04 10:25:16.0
Seoul, South Korea – Flexible SMT production has entered into a new dimension. Koh Young Technology’s 3D SPI (Solder Paste Inspection) system has now expanded its solution to perform complex dispensing. Koh Young highlighted the latest innovations, including its new high-precision, integrated dispenser for the KY8030-3 3D SPI in Stand 1F45 at NEPCON South China, which occurred August 28-30, 2018 in Shenzhen, China.
Industry News | 2013-02-12 13:15:17.0
SEHO Systems GmbH now offers a new technology for virtually void-free soldering results with the MaxiReflow HP.
Industry News | 2014-09-26 21:34:29.0
Computrol, Inc. announces that it will exhibit in Booth #233 at Design 2 Part Portland, scheduled to take place Oct. 29-30, 2014 at the Portland Expo Center in Portland, OR.
Industry News | 2003-06-13 10:10:58.0
By combining PacTech's electroless under bump metallization (UBM) processing with DEK's advanced mass imaging systems to create the solder bumps, users can implement a wafer-level, SMT-compatible flip chip assembly process.
Industry News | 2016-01-25 15:31:31.0
January 20, 2016 – Rolling Meadows, IL and Springfield, VA – Demand for Panasonic’s Total Solutions for “Any Mix Any Volume” continues to increase. Atlantech, Inc. has recruited Mr. Bryce Timms as a value-added sales representative to manage opportunities in Eastern Tennessee, South Carolina, Georgia, and selected accounts in North Carolina.
Industry News | 2023-12-11 12:19:27.0
Transition Automation, Inc. recently received a large order for Advanced Holder and Blade Assemblies compatible with DEK printers from Rotec BV in Belgium. This order – the third in recent months to Rotec – comes as Transition Automation seeks to realign Permalex distribution with a concentration on high-tier partners.
Industry News | 2010-04-22 20:32:49.0
MINNEAPOLIS - CyberOptics Corporation (Nasdaq: CYBE), a leading SMT inspection solutions provider, announced that it has been awarded the 2010 EMAsia Innovation Award for its SE500, a 3-D Solder Paste Inspection system. The award was presented to CyberOptics on April 21, 2010 at the Shanghai Everbright Convention & Exhibition Center during NEPCON China 2010.
Technical Library | 2020-09-23 21:37:25.0
The need to minimise thermal damage to components and laminates, to reduce warpage-induced defects to BGA packages, and to save energy, is driving the electronics industry towards lower process temperatures. For soldering processes the only way that temperatures can be substantially reduced is by using solders with lower melting points. Because of constraints of toxicity, cost and performance, the number of alloys that can be used for electronics assembly is limited and the best prospects appear to be those based around the eutectic in the Bi-Sn system, which has a melting point of about 139°C. Experience so far indicates that such Bi-Sn alloys do not have the mechanical properties and microstructural stability necessary to deliver the reliability required for the mounting of BGA packages. Options for improving mechanical properties with alloying additions that do not also push the process temperature back over 200°C are limited. An alternative approach that maintains a low process temperature is to form a hybrid joint with a conventional solder ball reflowed with a Bi-Sn alloy paste. During reflow there is mixing of the ball and paste alloys but it has been found that to achieve the best reliability a proportion of the ball alloy has to be retained in the joint, particular in the part of the joint that is subjected to maximum shear stress in service, which is usually the area near the component side. The challenge is then to find a reproducible method for controlling the fraction of the joint thickness that remains as the original solder ball alloy. Empirical evidence indicates that for a particular combination of ball and paste alloys and reflow temperature the extent to which the ball alloy is consumed by mixing with the paste alloy is dependent on the volume of paste deposited on the pad. If this promising method of achieving lower process temperatures is to be implemented in mass production without compromising reliability it would be necessary to have a method of ensuring the optimum proportion of ball alloy left in the joint after reflow can be consistently maintained. In this paper the author explains how the volume of low melting point alloy paste that delivers the optimum proportion of retained ball alloy for a particular reflow temperature can be determined by reference to the phase diagrams of the ball and paste alloys. The example presented is based on the equilibrium phase diagram of the binary Bi-Sn system but the method could be applied to any combination of ball and paste alloys for which at least a partial phase diagram is available or could be easily determined.
