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Machine Vision Products (MVP) AOI Solutions for SMT and SPI Inspection

Machine Vision Products (MVP) AOI Solutions for SMT and SPI Inspection

Videos

Overview of Machine Vision Product's Supra E, Ultra IV and Spectra Automated Optical Inspection Systems.

Machine Vision Products, Inc

epoxy resin meter mix and dispensing machine for Current and Voltage Sensors

epoxy resin meter mix and dispensing machine for Current and Voltage Sensors

Videos

epoxy resin meter mix and dispensing machine for Current and Voltage Sensors Whatsapp +86 134 2516 4065                                                            Model: PGB-200 PGB-200-800 system accurately meters, mixes and dispenses two-compon

Guangzhou Daheng Automation Equipment Co.,LTD

StenTech Honored by 2024 NPI Awards for New Cutting-Edge Chemical Vapor Deposition Surface Treatment for SMT Stencils!

Industry News | 2024-03-11 17:57:27.0

StenTech® Inc. is proud to announce that it has been honored with a prestigious CIRCUITS ASSEMBLY 2024 NPI (New Product Introduction) Award in the category of Screen/Stencil Printing Peripherals/Consumables for its groundbreaking innovation - the StenTech BluPrint™ CVD (Chemical Vapor Deposited) Surface Treatment. Engineered to elevate Surface Mount Technology (SMT) processes, this advanced coating offers a comprehensive set of benefits that collectively contribute to improved stencil performance, longevity, and the overall quality of the SMT assembly process, streamlining production.

Stentech

Board Design and Assembly Process Evaluation for 0201 Components on PCBs

Technical Library | 2023-05-02 19:06:43.0

As 0402 has become a common package for printed circuit board (PCB) assembly, research and development on mounting 0201 components is emerging as an important topic in the field of surface mount technology for PWB miniaturization. In this study, a test vehicle for 0201 packages was designed to investigate board design and assembly issues. Design of Experiment (DOE) was utilized, using the test vehicle, to explore the influence of key parameters in pad design, printing, pick-andplace, and reflow on the assembly process. These key parameters include printing parameters, mounting height or placement pressure, reflow ramping rate, soak time and peak temperature. The pad designs consist of rectangular pad shape, round pad shape and home-based pad shape. For each pad design, several different aperture openings on the stencil were included. The performance parameters from this experiment include solder paste height, solder paste volume and the number of post-reflow defects. By analyzing the DOE results, optimized pad designs and assembly process parameters were determined.

Flextronics International

SHENMAO PF735-P267J Low Melting Point Paste Is Designed for Jet Dispensing

Industry News | 2022-05-18 13:07:51.0

SHENMAO America, Inc. offers PF735-P267J Low Melting Point Lead-Free Jetting Solder Paste specially designed for the jetting process. It offers excellent workability and solderability for automatic high-speed jetting production with superior accuracy and precision.

Shenmao Technology Inc.

Seika Machinery’s Solder Paste Recycling Unit Honored for Being Environmentally Friendly by the Global Technology Awards

Industry News | 2010-10-27 18:31:39.0

Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, announces that it has been awarded a Global Technology Award in the category of Environmentally Friendly Products/Services for its Solder Paste Recycling (SPR) unit.

Seika Machinery, Inc.

Nihon Superior Introduces Lead-free Solder Paste for 0402 Metric Chip Components

Industry News | 2009-03-05 15:03:01.0

OSAKA, JAPAN � March 2009 � Nihon Superior Co. Ltd., a supplier of advanced soldering and brazing materials to the global market, announces the development of SN100C P520 D5 lead-free solder paste for 0402 metric chip components.

Nihon Superior Co., Ltd.

FCT Assembly to Present Its New Process for Evaluating Solder Pastes at APEX

Industry News | 2015-01-19 20:59:27.0

FCT Assembly today announced that it will present a new process for evaluating solder pastes in Booth #713 at the IPC APEX EXPO, scheduled to take place Feb. 24-26, 2015 at the San Diego Convention Center in California. Field application engineer, Tony Lentz, also will present the paper written on the new evaulation process titled “Dispelling the Black Magic of Solder Paste.” The presentation will be held during the Fluxes Technical Conference Session on Tuesday, Feb. 24 from 1:30-3 p.m.

FCT ASSEMBLY, INC.

Ormet Circuits Inc. Awarded for New Transient Liquid Phase Sintering Paste

Industry News | 2020-10-29 07:50:45.0

Ormet Circuits Inc. received a 2020 Mexico Technology Award in the category of Thermal Interface Materials for its Ormet® DAP-491-1 TLPS paste. The award was announced during a Virtual Awards Ceremony onMonday, October 26, 2020.

Ormet Circuits, Inc.

STI Electronics, Inc. Named as AIM's Distributor for the Southeast Region

Industry News | 2009-02-05 01:53:38.0

MADISON, AL � February 2009 �STI Electronics Inc., a full service organization providing training, consulting, laboratory analysis, prototyping, small- to medium-volume PCB assembly, and electronic as well as industrial supply sales, announces that it has been appointed as a distributor for the complete AIM line of electronic solders and chemicals throughout the Southeast.

STI Electronics


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