Events Calendar | Tue Apr 13 00:00:00 EDT 2021 - Tue Apr 13 00:00:00 EDT 2021 | ,
Boston Chapter Webinar: Cleaning Chemistry For PWB and Rework - Part 2, session 1
Events Calendar | Tue Apr 13 00:00:00 EDT 2021 - Tue Apr 13 00:00:00 EDT 2021 | ,
Boston Chapter Webinar: Cleaning Chemistry For PWB and Rework - Part 2, session 2
Industry News | 2015-07-27 20:29:13.0
The SMTA Capital Chapter is pleased to invite you to its upcoming Capital Expo and Tech Form at Johns Hopkins Applied Physics Lab, Kossiakoff Center, 11100 Johns Hopkins Road, Laurel, MD 20723, on September 1st. Exhibitors can save $100 by taking advantage of the early registration promotion available through July 31st. Contact Kaitlyn Gherity, SMTA Expo Manager, at 952-920-7682 or kaitlyn@smta.org to exhibit.
Industry News | 2010-09-02 16:09:40.0
Each step in the electronics assembly process will be on display and fully functioning on the show floor at Electronics Midwest, produced by IPC — Association Connecting Electronics Industries® and Canon Communications.
Industry News | 2013-01-19 07:46:16.0
Information that inspires innovation is center-stage for design, printed boards, electronics assembly, test and printed electronics
Industry News | 2016-04-06 04:45:41.0
Inventec Performance Chemicals (Inventec) will present the technical paper, “Reliability Assessment of No Clean and Water Soluble Solder Pastes, Part II” at the SMTA’s South East Asia Technical Conference.
Industry Directory | Manufacturer
AIM is a leading global manufacturer of solder assembly materials for the electronics industry.
Industry News | 2017-11-24 20:19:27.0
SHENMAO Introduces New Generation Lead-Free Solder Paste PF606-P140 to solve HoP issues and improve ICT Testability at SMTA Exhibition: November 29, 2017 booth # 22, 9 am to 3 pm Bestronics Facility, 2243 Lundy Ave, San Jose, CA 95131
Technical Library | 2017-03-22 20:58:08.0
Water soluble lead-free solder paste is widely used in today’s SMT processes, but the industry is slowly moving away from water soluble solder pastes in favor of no-clean solder pastes. This shift in usage of solder paste is driven by an effort to eliminate the water wash process. Some components cannot tolerate water wash and elimination of water washing streamlines the SMT process. Despite this shift, certain applications lend themselves to the use of water soluble solder paste.This paper details the research and development of a new water soluble lead-free solder paste which improves on the performance characteristics of existing technologies.
