Full Site - : solder paste water soluble m705-515 (Page 6 of 60)

Sn42Bi57Ag1 Solder Paste NP505-LT

Sn42Bi57Ag1 Solder Paste NP505-LT

New Equipment | Other

Sn42Bi57Ag1 Solder Paste NP505-LT lead-free soldering paste SMT Solder Paste Sn42Bi57Ag1 Solder Paste NP505-LT flux solder paste Product description: Sn42Bi57Ag1 Solder Paste NP505-LT  INQUIRY Sn42Bi57Ag1 Solder Paste NP505-LT Pr

Flasonsmt Co.,ltd

AQUANOX® A8831 - Aqueous Spray-in-Air Stencil / Maintenance Cleaner

AQUANOX® A8831 - Aqueous Spray-in-Air Stencil / Maintenance Cleaner

New Equipment | Cleaning Agents

AQUANOX® A8831 is a mild formulation that is compatible with stencils and effectively removes all types of solder pastes (water soluble, rosin, and no-clean) from fine pitch apertures. Aquanox A8831 is a low odor cleaner than can be used in open

KYZEN Corporation

Sn42Bi57Ag1 Solder Paste NP505-LT

Sn42Bi57Ag1 Solder Paste NP505-LT

New Equipment | Other

Sn42Bi57Ag1 Solder Paste NP505-LT lead-free soldering paste SMT Solder Paste Sn42Bi57Ag1 Solder Paste NP505-LT flux solder paste Product description: Sn42Bi57Ag1 Solder Paste NNP505-LT is a no-clean, Pb-free, zero-halogen solder paste for asse

qismt electronic co.,ltd

100g Solder Paste for BGA refwork mobile phone repare

100g Solder Paste for BGA refwork mobile phone repare

New Equipment | Other

100g Solder Paste for BGA refwork mobile phone repare 100g Solder Paste BGA refwork Solder Paste mobile phone repare Solder Paste 100g Solder Paste for BGA refwork Product description: 100g Solder Paste for BGA refwork mobile phone repare &

Flasonsmt Co.,ltd

Sn42Bi57Ag1 Solder Paste NP505-LT

Sn42Bi57Ag1 Solder Paste NP505-LT

New Equipment | Other

Sn42Bi57Ag1 Solder Paste NP505-LT lead-free soldering paste SMT Solder Paste Sn42Bi57Ag1 Solder Paste NP505-LT flux solder paste Product description: Sn42Bi57Ag1 Solder Paste NNP505-LT is a no-clean, Pb-free, zero-halogen solder paste for asse

Flasonsmt Co.,ltd

ALPHA® Preforms with solder paste adds solder volume.

ALPHA® Preforms with solder paste adds solder volume.

Videos

ALPHA® Preforms with solder paste adds solder volume.

MacDermid Alpha Electronics Solutions

Size Matters - The Effects of Solder Powder Size on Solder Paste Performance

Technical Library | 2020-10-27 02:02:17.0

Solder powder size is a popular topic in the electronics industry due to the continuing trend of miniaturization of electronics. The question commonly asked is "when should we switch from Type 3 to a smaller solder powder?" Solder powder size is usually chosen based on the printing requirements for the solder paste. It is common practice to use IPC Type 4 or 5 solder powders for stencil designs that include area ratios below the recommended IPC limit of 0.66. The effects of solder powder size on printability of solder paste have been well documented. The size of the solder powder affects the performance of the solder paste in other ways. Shelf life, stencil life, reflow performance, voiding behavior, and reactivity / stability are all affected by solder powder size. Testing was conducted to measure each of these solder paste performance attributes for IPC Type 3, Type 4, Type 5 and Type 6 SAC305 solder powders in both water soluble and no clean solder pastes. The performance data for each size of solder powder in each solder paste flux was quantified and summarized. Guidance for choosing the optimal size of solder powder is given based on the results of this study.

FCT ASSEMBLY, INC.

IONOX I3302 Broad Spectrum Electronics Cleaner

IONOX I3302 Broad Spectrum Electronics Cleaner

New Equipment | Cleaning Agents

IONOX I3302 is a semi-aqueous cleaning agent designed for cleaning the most challenging SMT Pb-free solder paste and tacky flux paste residues. This solution is also safe and effective for use on the newest Sn/Bi solder paste formulas.  I3302 is high

Southwest Systems Technology

KYZEN E5615 Fast Drying Stencil Cleaner

KYZEN E5615 Fast Drying Stencil Cleaner

New Equipment | Cleaning Agents

KYZEN E5615 is an aqueous-based cleaner designed to be the fastest drying chemistry in the industry. E5615 is engineered to reduce stencil underwipe coefficient of variation and improve solder paste release. KYZEN E5615 is shipped ready to use and su

Southwest Systems Technology

KYZEN E5611 Stencil And Misprinted Board Cleaner

KYZEN E5611 Stencil And Misprinted Board Cleaner

New Equipment | Cleaning Agents

KYZEN E5611 is a concentrated aqueous cleaning chemistry designed to remove non-reflowed solder paste and uncured chip bonder adhesives from stencils and hardware following the printing process. E5611 works on a wide range of solder paste technologie

Southwest Systems Technology


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SMT spare parts - Qinyi Electronics

Reflow Soldering 101 Training Course
Selective soldering solutions with Jade soldering machine

Wave Soldering 101 Training Course
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Best Reflow Oven
Pillarhouse USA for handload Selective Soldering Needs

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PCB Depanelizers

Low-cost, self-paced, online training on electronics manufacturing fundamentals