Full Site - : solder paste water soluble m705-515a-hn (Page 16 of 52)

SHENMAO Establishes Testing Laboratory in Taiwan – Cheetah Inspection, Inc.

Industry News | 2021-04-01 08:12:08.0

SHENMAO is pleased to announce that it has established an independent testing laboratory in Taiwan called Cheetah Inspection Inc. The ISO/IEC 17025 approved testing laboratory is located in Hsinchu, and builds upon SHENMAO's 48 years of packaging and assembly experience.

Shenmao Technology Inc.

SHENMAO to Highlight High-Rel Solder Sphere and Thermal Fatigue Resistant Paste at APEX

Industry News | 2022-01-10 16:49:36.0

SHENMAO America, Inc. is pleased to announce plans to exhibit in Booth #2534 during the 2022 IPC APEX EXPO, scheduled to take place Jan. 25-27, 2022 at the San Diego Convention Center in California. The company will highlight its PF918-S High Reliability Solder Sphere and PF918-P250 Thermal Fatigue Resistance Lead-free Solder Paste. The new paste is formulated with the new SHENMAO Sn/4Ag/3Bi Alloy design with high thermal impact reliability.

Shenmao Technology Inc.

High Thermal Impact Reliability BGA Sphere from SHENMAO

Industry News | 2022-07-16 08:39:50.0

SHENMAO America, Inc. is pleased to announce that the PF918-S Lead-Free BGA Sphere features the newly designed high-reliability alloy PF918 that can achieve tensile strength performance 1.4 times higher than the typical SAC305 alloy.

Shenmao Technology Inc.

SHENMAO Debuts Visible No-Clean BGA Flux SMBF-08 for Enhanced SMT Assembly and BGA Ball Mount Process

Industry News | 2023-05-22 18:45:34.0

SHENMAO America, Inc. is proud to announce the release of its new SMBF-08 Visible No-Clean BGA Flux. This innovative flux is specifically designed to meet the demands of surface mount technology (SMT) assembly and BGA ball mount processes, offering enhanced visibility and performance.

Shenmao Technology Inc.

FCT Assembly to Showcase Proven Solder Paste and Stencil Technologies at SMTA International 2011

Industry News | 2011-09-21 13:59:11.0

FCT Assembly announces that it will showcase its new line of no-clean, halogen-free solder pastes along with its latest stencil technologies in Booth #206 at the upcoming SMTA International Conference & Exhibition.

FCT ASSEMBLY, INC.

See FCT Assembly’s Best-in-Class Solder and Stencil Technologies at the 2012 IPC APEX Expo

Industry News | 2012-01-24 16:23:30.0

FCT Assembly will showcase its new line of no-clean, halogen-free solder pastes along with its latest stencil technologies in Booth #612 at the upcoming IPC APEX Expo.

FCT ASSEMBLY, INC.

SHENMAO Picks up Award for New Low Temperature Solder at SMTA Guadalajara

Industry News | 2019-10-24 16:29:44.0

SHENMAO America, Inc. announces that it was awarded a 2019 Mexico Technology Award in the category of Solder Paste for its PF735-PQ10 Low Temperature Solder (LTS). The award was presented to the company during a Wednesday, Oct. 23, 2019 ceremony that took place during the SMTA Guadalajara Expo & Tech Forum.

Shenmao Technology Inc.

SHENMAO Awarded for New Low Temperature Solder at productronica

Industry News | 2019-11-13 11:33:38.0

SHENMAO America, Inc. announces that it was awarded a 2019 Global Technology Award in the category of Solder Paste for its PF735-PQ10 Low Temperature Solder (LTS). The award was presented to the company during a Tuesday, Nov. 12, 2019 ceremony that took place during productronica in Munich, Germany.

Shenmao Technology Inc.

High Thermal & Impact Reliability Solder Alloys from SHENMAO at IWLPC

Industry News | 2018-10-22 18:35:12.0

SHENMAO Technology today announced plans to exhibit at the International Wafer-Level Packaging Conference, scheduled to take place Oct. 23-25, 2018 at the DoubleTree by Hilton San Jose in California. SHENMAO plans to showcase its new PF906-S and PF912-S solder alloys.

Shenmao Technology Inc.

The Balver Zinn Group to Highlight a Host of Solder Materials during SMT/HYBRID/PACKAGING 2013

Industry News | 2013-03-18 09:48:32.0

The Balver Zinn Group will exhibit numerous leading-edge products at the upcoming SMT/HYBRID/PACKAGING on booth #9-312, which is scheduled to take place from 16-18 April 2013 at the exhibition center in Nuremberg, Germany.

Balver Zinn


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