New Equipment | Cleaning Agents
MICRONOX® MX2302 is an engineered semiaqueous solvent blend designed to remove difficult flux and paste residues including lead-free, rosin, no-clean, and tacky flux from wafer bumps found in flip chip, chip scale and μBGA packages. MICRONOX® MX2302
New Equipment | Cleaning Agents
MICRONOX MX2302 is an engineered semi-aqueous solvent blend designed to remove difficult flux and paste residues from wafer bumps found in die-attach, flip chip, copper pillar, and emerging semiconductor assemblies. MX2302 is used as received in all
New Equipment | Cleaning Agents
AQUANOX A8820D is a pour and go engineered micro-cell cleaning fluid designed to remove wet solder paste and uncured adhesive from stencils used in surface mount printing processes. A8820D removes all un-reflowed solder paste using spray-in-air and s
Industry News | 2016-06-05 13:20:49.0
SHENMAO PF606-P116 Halogen Free Water Soluble LED Die Bonding Solder Pastes are made locally in the USA and with the same quality in 8 other worldwide locations.
Industry News | 2017-03-13 10:58:51.0
Kester is proud to announce the launch of WP601-ZH, a zero-halogen, lead-free, water-soluble solder paste formula for both nitrogen and air reflow applications. WP601-ZH is a breakthrough in water-soluble solder paste technology, providing a combination of consistent print performance at wide humidity levels, excellent solderability and ease of cleaning, while maintaining a zero-halogen flux formulation.
New Equipment | Assembly Services
Flexible PCB Assy Services: Regular PCB assy, entire flow including PCB manufacturing, parts sourcing, completely PCB assy, and testing Partial PCB assy, we finish PCB assy on customers provided blank PCBs, or semi-assembled boards meanwhile prot
Sn96.5Ag3.0Cu0.5 no-clean Solder Paste NP560 lead-free soldering paste SMT Solder Paste Sn96.5Ag3.0Cu0.5 no-clean Solder Paste NP560 flux solder paste Product description: Sn96.5Ag3.0Cu0.5 no-clean Solder Paste NP560 is a no-clean, lead-free,
New Equipment | Cleaning Equipment
SMT PCBA Offline Cleaning Machine SME-5600 Cleaning basket size L610 x W560 x H100 (mm) x2 layers Spray tank capacity 17L Clean time 5~20min Machine weight 460KG Product description: SMT PCBA Offline Cleaning Machine SME-5600 INQUIRY
Sn96.5Ag3.0Cu0.5 no-clean Solder Paste NP560 lead-free soldering paste SMT Solder Paste Sn96.5Ag3.0Cu0.5 no-clean Solder Paste NP560 flux solder paste Product description: Sn96.5Ag3.0Cu0.5 no-clean Solder Paste NP560 is a no-clean, lead-free,
New Equipment | Cleaning Agents
KYZEN E5631J is a ready-to-use solution for removing raw solder paste from stencils both in online and offline stencil cleaning processes. E5631J is a cost-effective solution that quickly and efficiently cleans all types of raw solder pastes to make
