When Applications Require Large Board Processing &/or Versatility The DS Series of dispensers is a robust, large format platform designed to handle all types of applications with ease. Ideal for dispense applications utilizing adhesive, solder paste
When Applications Require Large Board Processing &/or Versatility The DS Series of dispensers is a robust, large format platform designed to handle all types of applications with ease. Ideal for dispense applications utilizing adhesive, solder paste
Used SMT Equipment | Soldering - Wave
Operating System: Windows based Details: • Dual pot-Lead and Lead Free • Includes full pot of Lead Free –SN100C solder and Lead SN63/PB37 solder • Carbon Steel Solder pots with high temperature protective coating • A
The DV-7000 Heli-Flow® pump is a third-generation encoded auger pump. The pump has a floating head for use with footed needles to make fast, repeatable dots of solder paste and silver epoxy. The dispense gap is mechanically controlled by the needle,
Industry News | 2014-02-13 16:40:22.0
Kurtz Ersa North America will display the proven POWERFLOW e N2 at the IPC APEX EXPO. The compact full tunnel wave soldering system significantly reduces solder consumption as well as the unit cost attributable to the process.
Industry News | 2013-11-27 11:26:06.0
Kurtz Ersa North America announces that Gorilla Circuits purchased a POWERFLOW N2 Full Nitrogen Tunnel Wave Solder Machine and VERSAFLOW 3/66 selective soldering machine.
Industry News | 2014-02-20 14:29:34.0
The VERSAFLOW 3/45 is the Most Widely Used In-line Selective Solder Platform
Industry News | 2017-09-24 15:52:30.0
Kurtz Ersa North America is pleased to announce that it recently completed tests with INTERFLUX® Electronics on a new solder alloy. The tests were run on INTERFLUX’s LMPA™-Q alloy on the VERSAFLOW selective solder machine. The company offers a full range of tests at its demo room in Plymouth.
Industry News | 2012-10-09 16:18:14.0
The ULTIMA Series Selective Soldering and Fluxing Systems offer a new solution for soldering through-hole components and connectors to surface mount and mixed technology PCBs. Numerous engineering and design innovations have resulted in compact, bench-top systems loaded with features that deliver a level of performance that, until now, would have made selective soldering cost-prohibitive for many low- and medium-volume PCB assemblers.
Industry News | 2014-03-25 19:48:35.0
EVS Internationalannounces that it has been awarded a 2014 NPI Award in the category of Soldering – Other for its EVS 500.
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